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Effect of Hysteresis on Measurements of Thin-Film Cell PerformanceDavid Albin* and Joseph del Cueto National Renewable Energy Laboratory, 1617 Cole Blvd., Denver, CO, USA 80401 ABSTRACT Transient or hysteresis effects in polycrystalline thin film CdS/CdTe cells are a function of pre-measurement voltage bias and whether Cu is introduced as an intentional dopant during back contact fabrication. When Cu is added, the current-density (J) vs. voltage (V) measurements performed in a reverse-to-forward voltage direction will yield higher open-circuit voltage (V oc ), up to 10 mV, and smaller short-circuit current density (J sc ), by up to 2 mA/cm 2 , relative to scanning voltage in a forward-to-reverse direction. The variation at the maximum power point, P max , is however small. The resulting variation in FF can be as large as 3%. When Cu is not added, hysteresis in both V oc and J sc is negligible however P max hysteresis is considerably greater. This behavior corroborates observed changes in depletion width, W d , derived from capacitance (C) vs voltage (V) scans. Measured values of W d are always smaller in reverse-to-forward voltage scans, and conversely, larger in the forward-to-reverse voltage direction. Transient ion drift (TID) measurements performed on Cu-containing cells do not show ionic behavior suggesting that capacitance transients are more likely due to electronic capture-emission processes. J-V curve simulation using Pspice shows that increased transient capacitance during light-soak stress at 100 ºC correlates with increased space-charge recombination. Voltagedependent collection however was not observed to increase with stress in these cells.