This paper proposes a dual metal gate, hetero-material tunneling interfaced junctionless tunnel field effect transistor (TFET), (DMG-HJLTFET), utilizing III-V compound semiconducting materials, InAs (low band-gap source material)/GaAs (higher band-gap channel and drain material) by applying the band-gap and dual material gate engineering. The 2-D TCAD simulations have been executed to explore the impact of tunnel gate process variations-work function and length on DC and analog figure of merits (FOMs) of DMG-HJLTFET. The extracted result parameters have also been compared to SMG (single metal gate)-HJLTFET and conventional Si-JLTFET. The DMG-HJLTFET attains improved ON current in the range of 88.5 Â 10 À6 A/μm and OFF current remains as low as 2.89 Â 10 À16 A/μm. It exhibits a high current switching ratio of 3.1 Â 10 11 as compared to SMG-HJLTFET (I ON = 24 Â 10 À6 A/μm and I ON /I OFF = 1.4 Â 10 11 ) and Si-JLTFET (I ON = 7 Â 10 À6 A/μm and I ON /I OFF = 1.8 Â 10 6 ). Further, the radio frequency/microwave (RF) parameters such as power gains (h 12 , UPG, and Gma), f max , and GBP have been compared for all three aforementioned devices. Moreover, the small signal admittance (Y) parameters have been examined to explore the possible scope of DMG-HJLTFET for future internet of everything communications and fast switching applications.