Investigation of cure stresses in non-conductive adhesive interconnects

Abstract

Special thanks go to Mr. Xu Cong and Ms. Shao Wei for their kind help.Most of all, I want to thank my wife, Wang Jie, for her complete support in every aspect of my life, and my parents and parents-in-law for their continuous encouragement. WM NANYANG ^w UNIVERSrrY5cAoo/ of Materials Science & Engineering