Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

Chao, Brook; Chae, Seung Hyun; Zhang, Xuefeng; Lu, Kaijun; Im, James S.; Ho, Paul S.

doi:10.1016/j.actamat.2006.12.019

Cited by 192 publications

(81 citation statements)

References 27 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…The responses of the microstructures to stress and EM can be summarized as follows: (Single column image) a D is the interdiffusion coefficient [36], C ij is the stiffness tensor in Voigt notation [35], [40], [41], r r r is the electrical resistivity [37]- [39], Z Sn and Z Cu are the effective charge numbers of Sn and Cu, respectively [36].…”

Section: Discussionmentioning

confidence: 99%

“…An isotropic interdiffusion coefficient for Sn, D, is used in studies of the interaction between external stresses and microstructural evolution. The interdiffusion coefficient is calculated using the intrinsic diffusion coefficients of Sn and Cu reported by Chao et al [36] and the formula for calculating interdiffusion coefficients derived by Darken [42]. …”

Section: Materials Parametersmentioning

confidence: 99%

See 1 more Smart Citation

Effects of Stress and Electromigration on Microstructural Evolution in Microbumps of Three-Dimensional Integrated Circuits

Xiong

Huang

Conway

2014

IEEE Trans. Device Mater. Relib.

View full text Add to dashboard Cite

Section: Discussionmentioning

confidence: 99%

Section: Materials Parametersmentioning

confidence: 99%

Effects of Stress and Electromigration on Microstructural Evolution in Microbumps of Three-Dimensional Integrated Circuits

Xiong

Huang

Conway

2014

IEEE Trans. Device Mater. Relib.

View full text Add to dashboard Cite

“…Що стосується кінетики росту ІМС, то в цьому питанні не має повної ясности: у частині робіт отримано лінійну залежність ширини прошарку ІМС від часу x  t [10][11][12][13], в іншій -параболічну x 2  t [6,8,13,14]. Аналіза кінетики і морфології ІМС у припайних з'єднаннях є до-сить непростою, оскільки різні ефекти можуть бути домінантними: електроміґрація, стиснення струму, термоміґрація.…”

Section: вступunclassified

“…Зараз більшість безоли-вних прилютків є стопами на основі цини (вміст Sn більше ніж 95 %), а отже, властивості цини є домінувальними в поведінці при-пою. Тому реакції на межі між циною і різними металевими під-ложжями (Ni, Cu, Ag), особливо при великих густинах струму, ін-тенсивно досліджуються [15][16][17].…”

Section: вступunclassified

Influence of Electromigration on Kinetics of Reaction Diffusion in the Cu—Sn System

Zraev¹

2016

Metallofiz. Noveishie Tekhnol.

View full text Add to dashboard Cite

Проведено експериментальне дослідження реакційної дифузії в системі Cu-Sn під дією постійного електричного струму густиною у 7,310 7 А/м 2 . Особливістю експерименту було те, що конструкція досліджуваного зраз-ка виключала можливість перенесення атомів Купруму від катоди до ано-ди через спільний прошарок цини. За таких умов ріст фази Cu 3 Sn  Cu 6 Sn 5 на аноді відбувається швидше, ніж на катоді. Кінетика росту відповідає лінійному часовому закону x  t. З використанням моделю процесу реа-кційної дифузії при електроміґрації було проведено аналізу одержаних експериментальних результатів.Ключові слова: електроперенесення, реакційна дифузія, інтерметалева сполука, Cu/Sn.The experimental study of the reaction diffusion under direct electric current in Cu-Sn system at temperature of 275C is performed. The current density is of 7.310 7 А/m 2 . In these experiments, anode and cathode have no joint contact through the solder layer. With this design of sample, the diffusion of copper atoms from the cathode to the anode is impossible. In these experimental conditions, the growth of the Cu 3 Sn  Cu 6 Sn 5 phase on the anode is faster than on the cathode. The growth kinetics of phase on the electrodes corresponds to a linear time law x  t. The voids' growth on the cathode is not observed. When the anode is joined to cathode by the solder layer, the Corresponding author: Semen Viktorovych Kornienko

show abstract

“…The η and ε intermetallic phases can form at the lower ranges of temperatures of this system, thus making them present in applications such as soldering of electronic devices. With the recent call to eliminate lead (Pb)-based solder [8]- [11], these intermetallics have thus been the focus of many researchers.…”

Section: Copper-tin Systemmentioning

confidence: 99%

Numerical modeling of bronze coating formation using concentration-dependent diffusivity

Damaceno

Ojo

2017

Int J Adv Manuf Technol

View full text Add to dashboard Cite

The engineering of a component's surface is of remarkable importance, it allows applications that surpass what is achievable by the substrate alone by improving surface properties such as hardness, wear and corrosion resistance and even aesthetic value. This project focuses on obtaining bronze coatings through the diffusion of electrodeposited tin on copper via heat treatment. Specifically, the single phase α is targeted due to its attractive properties. Determining the correct heat treatment parameters is crucial since only a specific range of compositions lead to the formation of the desired microstructure and, consequently, properties. The diffusion of a thin coating of tin onto copper often leads to the formation of undesirable features: small craters containing different phases than the one targeted. In the present work, the diffusion behavior of tin-copper couple was investigated; a numerical model was developed to predict the composition profile after heat treatment, which agrees with experimental observations; and the mechanism for the formation of undesirable surface craters during heat treatment was studied and the probable solution proposed. II Acknowledgements

show abstract

Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

Cited by 192 publications

References 27 publications

Effects of Stress and Electromigration on Microstructural Evolution in Microbumps of Three-Dimensional Integrated Circuits

Effects of Stress and Electromigration on Microstructural Evolution in Microbumps of Three-Dimensional Integrated Circuits

Influence of Electromigration on Kinetics of Reaction Diffusion in the Cu—Sn System

Numerical modeling of bronze coating formation using concentration-dependent diffusivity

Contact Info

Product

Resources

About