Investigation of Discarded Printed Circuit Boards for Recovery of Copper Values

Barnwal, Amit; Dhawan, Nikhil

doi:10.1007/s11837-020-04113-8

Cited by 7 publications

(2 citation statements)

References 28 publications

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“…Instead of using heavy media separation, tapped density calculation was preferred ensuring no liquid entry and contamination of the samples. The tapped density of a powder is the ratio of the mass of the powder to the volume occupied by the powder after being tapped for a defined period, and it represents a random dense packing [5,44]. The variation of tapped density for different flotation products belonging to various size classes is shown in Fig.…”

Section: Flotation Processmentioning

confidence: 99%

“…Printed circuit boards (PCBs) are an integral part of most electronic equipment and, on average, comprise 40% metals, 30% plastics, and 30% ceramics [2]. Effective utilization of waste PCBs offers tremendous recycling potential for the recovery of base metals (Cu, Ni, Fe, Sn, Pb) and precious metal (Au, Ag) values [3][4][5]. Poor recovery of the base and precious metals is a significant challenge for physical processing as they deport to the fine fraction as a by-product during size reduction.…”

Section: Introductionmentioning

confidence: 99%

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Processing of Discarded Printed Circuit Board Fines via Flotation

Barnwal

Mir

Dhawan

2020

J. Sustain. Metall.

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The recovery of metals from discarded printed circuit boards using environmentally-friendly physical routes is gaining importance. Physical separation of metal values from non-metallic constituents exploits various characteristics of crushed powder such as density, liberation, shape, size, and wettability. However, the generation of fines during grinding/crushing of the printed circuit boards is an unavoidable but essential by-product. The fine fractions are discarded due to the higher amounts of non-metallic fraction and poor separation of metallic values. In this study, the flotation process was studied to separate metallic and non-metallic values without the addition of external additives from the fine fraction of printed circuit boards (< 212 µm). The natural hydrophobic response of plastic and organic matter in fines stabilized the froth without additional reagents. The difference in tapped density for tailing (~ 0.5 g/cm 3 ) and concentrate (~ 2.7 g/cm 3 ) fraction ensures good separation. The metallic fraction increases from 14.3% in the feed to 91.7% in the concentrate. Recovery for metallic values was observed as ~ 72.3% with a purity of ~ 92% and comprised 77.9% Cu, 8.3% Sn, and 5.5% Pb.The contributing editor for this article was Veena Sahajwalla.

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Section: Flotation Processmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Processing of Discarded Printed Circuit Board Fines via Flotation

Barnwal

Mir

Dhawan

2020

J. Sustain. Metall.

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Recovery limitation due to metal loss to fiberglass particles during printed circuit board leaching and probable mechanisms

Oluokun,

Otunniyi

2023

J Mater Cycles Waste Manag

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Insight into Limited Recoveries in Printed Circuit Board Leaching: Evidence of Gold Adsorption Loss to Polymeric Particles

Oluokun,

Otunniyi

2024

J. Sustain. Metall.

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Sustainable resource utilization ultimately depends on total recovery during recycling operations. PCB leach pulp for target metal recovery contains ceramic and polymeric particles resistant to reagent attack. The investigation herein shows the physicochemical behavior of five polymeric particles namely green, red, black, white, and blue in gold chloride complex [AuCl4]− solution. Gold concentration change was monitored over time to study how the gold solution interacted with the polymeric particles and how the interaction conforms to known adsorption isotherm and kinetic models. The black and green polymeric particles have the highest adsorption per unit mass to about 1.81 mg/g and 2.18 mg/g, respectively. Four adsorption kinetic models evaluated for insight on the adsorption mechanism observed show Elovich and pseudo-second-order (PSO) models fit the kinetic data best compared to other models with correlation coefficients of 0.9867 and 0.9863, respectively. Of the seven adsorption isotherm models evaluated, Sips model shows best fit for the isotherm data with correlation coefficients of 0.9727 and 0.9328 for green and black particles, respectively. Isotherm and kinetic model analyses of the experimental data indicated physisorption and chemisorption as driving mechanism of the interaction between PCB polymeric particles and gold chloride complex aliquot. Graphical Abstract

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Investigation of Discarded Printed Circuit Boards for Recovery of Copper Values

Cited by 7 publications

References 28 publications

Processing of Discarded Printed Circuit Board Fines via Flotation

Processing of Discarded Printed Circuit Board Fines via Flotation

Recovery limitation due to metal loss to fiberglass particles during printed circuit board leaching and probable mechanisms

Insight into Limited Recoveries in Printed Circuit Board Leaching: Evidence of Gold Adsorption Loss to Polymeric Particles

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