Investigation of dynamic and mechanical thermal behavior of isotropic conductive adhesives

Abstract

Isotropic conductive adhesive (ICAs) are considered as the most promising replacement to lead or lead free solders due to relatively low melting point, simple processing, low processing temperature and fine pitch capability. The study aims to instigate the dynamic mechanical and thermal properties of diglycidylether of bisphenol-A (DGEBA) and polyurethane (PU) based ICAs. Dynamic mechanical thermal analysis (DMTA) is one of the ways to estimate changes, which occur for polymeric materials in the broad range of temperature and frequency of changes in load. In this study, the results showed that measurement of storage modulus, loss modulus and also damping factor of the samples formulated with DGEBA has better thermal mechanical properties than the samples formulated with PU. In addition, by changing the conventional silver flakes to silver nanoparticles; the results shows that nanoparticles make a little improvement in thermal mechanical properties for the temperature beyond T g. For silver flake formulation with DGEBA, the result shown that the samples with higher volume fraction of silver flake shows a better thermal mechanical properties.