2024
DOI: 10.1088/2053-1591/ad6eef
|View full text |Cite
|
Sign up to set email alerts
|

Investigation of dynamic characteristics and fatigue life prediction of Pb free solder material under random vibration

Saravanakumar K,
S Saravanan,
N Muthuram

Abstract: Electronic packages are employed in diverse industries, including automotive, aerospace, and defense. However, their susceptibility to failure arises from exposure to uncontrolled operating conditions, particularly vibrations.Therefore, an investigation has been conducted to explore the effect of vibration in fatigue life of SAC305 lead free solder material employed in Printed Circuit Board (PCB) assembly with ball grid array (BGA) 144 electronic package. Finite Element Analysis (FEA) of a printed circuit boa… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Publication Types

Select...

Relationship

0
0

Authors

Journals

citations
Cited by 0 publications
references
References 20 publications
0
0
0
Order By: Relevance

No citations

Set email alert for when this publication receives citations?