Investigation of Elastic Fields within Through-silicon Vias using a Finite Element Model with Thermal Stresses and Joule Heating Present

Zeng, Qibiao; Gao, Yimin; Zhen, Yang; Zhou, Peng

doi:10.1109/icept.2018.8480505

2018 19th International Conference on Electronic Packaging Technology (ICEPT) 2018

DOI: 10.1109/icept.2018.8480505

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Investigation of Elastic Fields within Through-silicon Vias using a Finite Element Model with Thermal Stresses and Joule Heating Present

Qibiao Zeng

Yimin Gao

Yang Zhen

et al.

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Investigation of Elastic Fields within Through-silicon Vias using a Finite Element Model with Thermal Stresses and Joule Heating Present

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