Investigation of Electrical Characteristics Dependency of Roll-to-Roll Printed Solar Cells With Silver Electrodes on Mechanical Tensile Strain

Salari, Majid; Joodaki, Mojtaba

doi:10.1109/tdmr.2019.2949116

Cited by 6 publications

(5 citation statements)

References 33 publications

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“…1 were tested under mechanical strain in this study [38,39]. We arranged a configuration similar to what previous researchers have used [40]. A tensile machine with 100 µm resolution was used to stretch the solar cell along its length.…”

Section: Methodsmentioning

confidence: 99%

“…Moreover, it shows that the capacitance rises as the cell is stretched meaning a reduction of the capacitive impedance, ZC, versus strain. Since it is known that RS increases with strain level as well [40], it may question the validity of the parallel model of Fig. 3b for the utmost tensions.…”

Section: Capacitance-frequencymentioning

confidence: 99%

“…3b for the utmost tensions. So we extracted RS values from the I-V curves using the method proposed by Werner [43] which has been used in previous studies as well [15,40]. As it is depicted in Fig.…”

Section: Capacitance-frequencymentioning

confidence: 99%

See 2 more Smart Citations

Characterization of Strain-induced Defects Density in Flexible Organic Photovoltaic Cells using Capacitance Spectroscopy

Salari

Naseri

Manesh

2020

J. Photopol. Sci. Technol.

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Section: Methodsmentioning

confidence: 99%

Section: Capacitance-frequencymentioning

confidence: 99%

See 1 more Smart Citation

Characterization of Strain-induced Defects Density in Flexible Organic Photovoltaic Cells using Capacitance Spectroscopy

Salari

Naseri

Manesh

2020

J. Photopol. Sci. Technol.

Self Cite

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“…However, when the PI layer thickness is less than ~17 μm, the CIGS layer undergoes tensile stress. Salari et al [12] observed that tensile stress is beneficial to improve the performance of organic solar cells. Moreover, as mentioned earlier, Garcia et al [4] observed that the performance of CIGS solar cells was improved by applying tensile stress.…”

Section: Effect Of Layer Thickness On the Internal Stress Caused By C...mentioning

confidence: 99%

Effects of Layer Thickness on the Residual Stresses of CIGS Solar Cells with Polyimide Substrate

Kim¹,

Xu²

2022

AMPC

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In this paper, we investigate the effect of layer thickness on the residual stresses of copper indium gallium diselenide (CIGS) solar cells with polyimide substrate caused by CIGS layer deposition at 400˚C and then cooling down to room temperature using the Finite Element Method (FEM). Moreover, we also examined the effect of layer thickness on residual stress of CIGS solar cells after cooling down to room temperature from the hotspot temperatures of 200˚C, 300˚C, and 400˚C. Our simulated CIGS is composed of five layers: ZnO, CdS, CIGS, Mo, and PI substrate. We were able to quantify the effect of each layer's thickness and hotspot temperature on the average stresses of each layer for the CIGS solar cells. We found that the PI substrate layer has the most significant effect on the residual stress of CIGS solar cells. Our simulation results reveal that the stress type (tensile vs. compressive) and the magnitude of stress of the CIGS layer (main absorber layer) can be controlled by changing the thickness of the PI substrate while applying a heat to CIGS solar cells. Quantitative analysis of relationship between layer thickness and thermo-mechanical stress of thin film solar cells can help solar cell manufacturers design more robust and reliable solar cells. For example, fabricating PI layer thickness less than 17 μm can improve the performance of CIGS solar cells by nullifying the compressive residual stress in the CIGS absorber layer.

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“…Of late, several printing technologies (such as roll-to-roll, [7][8][9][10] screen, [11][12][13] inkjet, [14][15][16] etc.) have been used to not only form and fabricate modern-day electronic devices and structures, but also to interconnect them directly on the polymer surfaces of flexible substrates with roughness in the order of micrometers.…”

Section: Introductionmentioning

confidence: 99%

Laue microdiffraction evaluation of bending stress in Au wiring formed on chip-embedded flexible hybrid electronics

Murugesan

Susumago

Sumitani

et al. 2021

Jpn. J. Appl. Phys.

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Au redistribution layers 10 to 100 μm wide were fabricated on heterogeneously integrated advanced flexible hybrid electronics (FHE) substrates formed by a die-first approach based on fan-out wafer-level packaging. The formed Au metal wiring was meticulously studied for locally induced mechanical stress upon bending (bending radius, BR 20 mm) using Laue microdiffraction (LμD) with synchrotron radiation. It was inferred from the LμD data that upon bending the FHE substrate up to the BR of 20 mm, the Au metal wiring (10 mm long, 100 μm wide, and 500 nm thick) experienced mechanical bending stress amounting to 250 ∼ 300 MPa. The stress values obtained from the LμD studies were close to the stress value of 350 MPa obtained by simulation.

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Investigation of Electrical Characteristics Dependency of Roll-to-Roll Printed Solar Cells With Silver Electrodes on Mechanical Tensile Strain

Cited by 6 publications

References 33 publications

Characterization of Strain-induced Defects Density in Flexible Organic Photovoltaic Cells using Capacitance Spectroscopy

Characterization of Strain-induced Defects Density in Flexible Organic Photovoltaic Cells using Capacitance Spectroscopy

Effects of Layer Thickness on the Residual Stresses of CIGS Solar Cells with Polyimide Substrate

Laue microdiffraction evaluation of bending stress in Au wiring formed on chip-embedded flexible hybrid electronics

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