2022
DOI: 10.1016/j.ijheatmasstransfer.2022.122535
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Investigation of fluid flow and heat transfer characteristics in a microchannel heat sink with double-layered staggered cavities

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Cited by 34 publications
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“…Since then, tremendous work has gone into enhancing microchannel heat sinks' ability to remove the heat created by electronic chips. To maximize the surface available for heat transmission, several microchannel geometries such as circular, rectangular, triangular, and trapezoidal designs (Figure 1) have been used in the creation of microchannel heatsinks (Liu et al, 2022;Zhang et al, 2022). They also employed high-thermal-conductivity materials including copper, aluminum, and silicon to build the microchannel heatsinks (Figure 2) (Japar et al, 2018;Jennings and Smith, 2020;Shamsuddin et al, 2021).…”
Section: Introductionmentioning
confidence: 99%
“…Since then, tremendous work has gone into enhancing microchannel heat sinks' ability to remove the heat created by electronic chips. To maximize the surface available for heat transmission, several microchannel geometries such as circular, rectangular, triangular, and trapezoidal designs (Figure 1) have been used in the creation of microchannel heatsinks (Liu et al, 2022;Zhang et al, 2022). They also employed high-thermal-conductivity materials including copper, aluminum, and silicon to build the microchannel heatsinks (Figure 2) (Japar et al, 2018;Jennings and Smith, 2020;Shamsuddin et al, 2021).…”
Section: Introductionmentioning
confidence: 99%