Investigation of Heat Diffusion at Nanoscale Based on Thermal Analysis of Real Test Structure

Raszkowski, Tomasz; Zubert, Mariusz

doi:10.3390/en13092379

Cited by 3 publications

(4 citation statements)

References 36 publications

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“…arg T(x,y,f) = ϕ(x,y,f) The experiments and analyses carried out by Tomasz Raszkowski in his PhD thesis [50,51], concerning the transformation of the DPL equation into the Grünwald-Letnikov fractional space-derivative dual-phase-lag equation [16,46,47], indicate a lower influence of the heat flux time lag parameter τq for the whole thermal system response than for the temperature time lag parameter τT.…”

Section: T(xyf)| [K]mentioning

confidence: 99%

“…Furthermore, the simultaneous change of temperature gradient and heat flux is a non-physical behaviour [9][10][11][12][13]; these phenomena have been presented in the case of nanosized structures in [8]. The second problem is associated with the radiative heat transfer and the Casimir effect (i.e., photons tunnelling) [14,15]; these phenomena occur in MEMSs [16] at small distances between surfaces (or particles). Both phenomena cause more dynamic and intense heat transfer than the classical Fourier-Kirchhoff and radiation models.…”

mentioning

confidence: 99%

“…Material parameters are collected in [1,30]; • Detailed description of the most commonly used heat transfer models at the nanoscale was presented in [16] (pp. 1-4) [22][23][24]30].…”

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confidence: 99%

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Application of Scattering Parameters to DPL Time-Lag Parameter Estimation at Nanoscale in Modern Integration Circuit Structures

et al. 2021

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This paper presents the methodology of material parameters’ estimation for the dual-phase-lag (DPL) model at the nanoscale in modern integration circuit (IC) structures. The analyses and measurements performed were used in the unique dedicated micro-electro-mechanical system (MEMS) test structure. The electric and thermal domain of this structure was analysed. Finally, the silicon dioxide (SiO2) temperature time-lag estimation procedure is presented based on the scattering parameters measured by a vector network analyser for the considered MEMS structure together with the 2-omega method. The proposed methodology has the ability to estimate the time-lag parameter with high accuracy and is also suitable for the temperature time-lag estimation for other manufacturing process technologies of ICs and other insulation materials used for integrated circuits such as silicon nitride (Si3N4), titanium nitride (TiN), and hafnium dioxide (HfO2).

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confidence: 99%

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Application of Scattering Parameters to DPL Time-Lag Parameter Estimation at Nanoscale in Modern Integration Circuit Structures

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“…The paper [45] describes an analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigations at the nanoscale. The results of computations and measurements are presented and discussed.…”

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confidence: 99%

Cooling Systems of Power Semiconductor Devices—A Review

Górecki

Posobkiewicz

2022

Energies

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In this paper, a detailed review of contemporary cooling systems of semiconductor devices is presented. The construction and the principles of operation of selected components of passive and active cooling systems, as well as selected computer tools supporting the design of such systems, are described. The dependences of thermal parameters calculated using these tools on selected factors characterizing the used cooling systems, e.g., the dimensions of their components, are presented and discussed. Additionally, some results of measurements illustrating the influence of selected parameters on the thermal resistance of power MOSFETs mounted in different cooling systems are shown. The properties of selected cooling systems are compared, and it is shown that by changing the type of cooling system, it is possible to reduce the thermal resistance value of a power MOSFET even 20 times. The presented considerations can make the process of designing cooling systems more effective.

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Analysis of Algorithm Efficiency for Heat Diffusion at Nanoscale Based on a MEMS Structure Investigation

Raszkowski

Zubert

2020

Energies

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This paper presents an analysis of the time complexity of algorithms prepared for solving heat transfer problems at nanoscale. The first algorithm uses the classic Dual-Phase-Lag model, whereas the second algorithm employs a reduced version of the model obtained using a Krylov subspace method. This manuscript includes a description of the finite difference method approximation prepared for analysis of the real microelectromechanical system (MEMS) structure manufactured by the Polish Institute of Electron Technology. In addition, an approximation scheme of the model, as well as the Krylov subspace-based model order reduction technique are also described. The paper considers simulation results obtained using both investigated versions of the Dual-Phase-Lag model. Moreover, the relative error generated by the reduced model, as well as the computational complexity of both algorithms, and a convergence of the proposed approach are analyzed. Finally, all analyses are discussed in detail.

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Investigation of Heat Diffusion at Nanoscale Based on Thermal Analysis of Real Test Structure

Cited by 3 publications

References 36 publications

Application of Scattering Parameters to DPL Time-Lag Parameter Estimation at Nanoscale in Modern Integration Circuit Structures

Application of Scattering Parameters to DPL Time-Lag Parameter Estimation at Nanoscale in Modern Integration Circuit Structures

Cooling Systems of Power Semiconductor Devices—A Review

Analysis of Algorithm Efficiency for Heat Diffusion at Nanoscale Based on a MEMS Structure Investigation

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