2023
DOI: 10.1016/j.ijheatmasstransfer.2023.124442
|View full text |Cite
|
Sign up to set email alerts
|

Investigation of heat transfer performance for through-silicon via embedded in micro pin fins in 3D integrated chips

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1

Citation Types

0
3
0

Year Published

2023
2023
2025
2025

Publication Types

Select...
6
1
1

Relationship

0
8

Authors

Journals

citations
Cited by 18 publications
(3 citation statements)
references
References 30 publications
0
3
0
Order By: Relevance
“…Micromachines 2024, 15, x FOR PEER REVIEW 20 of W/poly-Si TSV with a trapezoidal voltage pulse applied [73]. (d) Effect of different TSV diamete on temperature and electrical resistance, and temperature distribution at the midline position [74 In terms of TSV electrical performance and system signal integrity, Vincenzo pr posed a dynamic electro-thermal macro modeling technique for signal integrity analys This method extracted the dynamic electro-thermal equivalent of multi-chip stack stru tures and estimated the thermally induced propagation delay through circuit simulatio using SPICE [75]. Wang studied the electro-thermal effects in TSVs and investigated th influence of temperature on the parasitic resistance and capacitance of TSVs by combinin copper characteristics with an equivalent circuit model [55], as shown in Figure 20a.…”
Section: Current Status Of Reliability Research On Multi-field Coupli...mentioning
confidence: 99%
“…Micromachines 2024, 15, x FOR PEER REVIEW 20 of W/poly-Si TSV with a trapezoidal voltage pulse applied [73]. (d) Effect of different TSV diamete on temperature and electrical resistance, and temperature distribution at the midline position [74 In terms of TSV electrical performance and system signal integrity, Vincenzo pr posed a dynamic electro-thermal macro modeling technique for signal integrity analys This method extracted the dynamic electro-thermal equivalent of multi-chip stack stru tures and estimated the thermally induced propagation delay through circuit simulatio using SPICE [75]. Wang studied the electro-thermal effects in TSVs and investigated th influence of temperature on the parasitic resistance and capacitance of TSVs by combinin copper characteristics with an equivalent circuit model [55], as shown in Figure 20a.…”
Section: Current Status Of Reliability Research On Multi-field Coupli...mentioning
confidence: 99%
“…Today, the main focus of integrated circuit developers is focused on creating new types of microprocessors and integrated circuits, as well as on the development of manufacturing technologies for semiconductor devices based on complex semiconductor materials [1][2]. Since the main reason for the failure of such devices is still the metallization system and contacts, research on the creation of multi-level systems is key [3][4].…”
Section: Introductionmentioning
confidence: 99%
“…After conducting optimization research on triangular pin-n arrangements, the full melt time was shortened by 14.3% and the heat dissipation power was increased by up to 15.2%, when compared with the PCM heat sink with triangular pin-ns, H. Pan et al [11]. In the investigation of heat transfer performance for through-silicon via embedded in micro pin ns in 3D integrated chips, it is obtained by the W. He et al [12] that the best comprehensive heat transfer performance was achieved with an extended n angle of 30 degrees for the micro pin ns.…”
Section: Introductionmentioning
confidence: 99%