Investigation of hydrothermal characteristics and entropy generation in a microchannel heat sink with elliptical fins

Abstract

As the integration of microelectronic devices continues to increase, thermal management issues become increasingly prominent. Microchannel heat sinks are effective for heat dissipation in high heat flux microelectronic devices. This study designs five elliptical finned microchannel heat sinks with different aspect ratios (γ) while maintaining a constant elliptical area to enhance heat transfer performance. The values of γ are 0.74, 0.86, 1, 1.17, and 1.35, respectively. Over the Reynolds number (Re) range of 293 to 740, the hydrothermal characteristics and entropy generation of the microchannels with elliptical fins (MC-EFs) are investigated through numerical simulations. The thermal enhancement mechanism of MC-EFs is analyzed via flow, temperature, and pressure fields. The optimal γ value is determined by maximizing the overall performance factor (OPF) and minimizing the augmentation entropy generation number (Ns,a). Results indicate that introducing elliptical fins in the straight microchannel (SMC) significantly improves heat dissipation. An increase in γ enhances thermal performance but also raises flow resistance. Specifically, when γ increases from 0.74 to 1.35, the Nusselt number (Nu) improves by 10.71%-25.64%, and the friction coefficient (f) increases by 30.92%-57.27%. Overall, at Re = 740, the OPF of the MC-EF with γ = 1.35 reaches a maximum of 1.285, and at Re = 597, the Ns,a for this configuration is minimized to 0.578. These findings provide valuable insights for effective thermal management in microelectronic devices.