Investigation of impedance compensation in radio frequency circuits with bonding wire

Abstract

Bonding wires are extensively used to provide electrical interconnections in communication systems. From the perspective of circuit analysis, the effects of such elements are often treated as an inductance. Bonding wires may cause inductive impedance discontinuity, which negatively impacts signal integrity. In this work, an impedance compensation technique using a chip capacitor was introduced. The electrical performance was improved significantly in the frequency band below 4 GHz. In order to expand the operating frequency of the circuit, another compensation approach based on adding a ground conductor was also studied. This compensation strategy is shown to be effective for frequencies up to 18 GHz. The results obtained from the model simulation for both strategies were also validated experimentally. The model simulation results for both approaches show good agreement with those obtained from the experimental measurements.

Applying Characteristic Impedance Compensation Cut-Outs to Full Radio Frequency Chains in Multi-Layer Printed Circuit Board Designs

“…In addition, there are scholarly works addressing the challenge of high bond wire interconnect inductance. This is achieved through the incorporation of a grounding pad in close proximity to the connection and the application of SMD capacitors [15][16][17]. This integration introduces supplementary capacitance into the RF chain, effectively mitigating overall impedance along the transmission line.…”