Investigation of Low-Melting Sn-Bi-In Solder Joints for Flexible Interconnects

Zhang, Shuye; Xu, Sunwu; He, Peng

doi:10.1109/icept63120.2024.10668541

2024 25th International Conference on Electronic Packaging Technology (ICEPT) 2024

DOI: 10.1109/icept63120.2024.10668541

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Investigation of Low-Melting Sn-Bi-In Solder Joints for Flexible Interconnects

Shuye Zhang,

Sunwu Xu,

Peng He

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Investigation of Low-Melting Sn-Bi-In Solder Joints for Flexible Interconnects

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References 11 publications

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