Investigation of Mechanical Properties and Microstructure of Tin-Zinc Eutectic Solder.

Creep properties of Sn-8Mass%Zn-3Mass%Bi lead-free alloy

“…[2][3][4][5][6][7] Although many studies on soldering and the interfacial reaction with Sn-Zn alloys have been performed, there are only a few studies on the mechanical properties of Sn-Zn alloys. 8,9 Mechanical properties, such as tensile strength, ductility, fatigue, and creep, are very important factors for the evaluation of the solder joint reliability and necessary for solder joint design, so characterization of these properties is needed. This paper reports the results of investigations for the creep properties of the Sn-8Zn-3Bi alloy.…”

Fatigue Reliability Evaluation for Sn–Zn–Bi and Sn–Zn Lead-Free Solder Joints

“…Moreover, Sn-9 mass%Zn solder has excellent ductility, which makes processing easy. 2) Therefore, Sn-9 mass%Zn solder is a promising lead-free solder material. On the other hand, the wettability of Sn-9 mass%Zn solder is not good during the reflow process because Zn is more rapidly oxidized than Pb.…”

“…The solid line can be regarded as an approximate line of the fatigue strength for the Sn-9Zn solder, because its result agrees with the result of the torsion test of Komatsu's research (slope ; À1:74). 16) In the case of the pre-flux specimens, all of the aged specimens have fatigue strength similar to that of the initial state Fatigue Reliability Evaluation for Sn-Zn-Bi and Sn-Zn Lead-Free Solder Joints(unaged) specimens, even if heat treatment is carried out at 150 C for 1000 h. When the specimens with Ni/Au plating were aged at 85 C for 1000 h or much higher temperature conditions, the fatigue strength is lower. Although the fatigue strength decreases, they have almost identical fatigue strength with the Sn-37Pb solder (dotted line).…”