Investigation of microstructure evolution and mechanical properties of 2024 Al/Al₂O₃ ceramic joints

Abstract

Low-temperature solder was used to join 2024 Al and Al 2 O 3 ceramic by an ultrasonic-assisted soldering process. Strong bonding between solder alloy and Al 2 O 3 ceramic could be obtained when the reactive wetting happened. Al 2 O 3 was formed during the reactive wetting process, and it is supposed to determine the joining strength of 2024 Al/Al 2 O 3 ceramic joints. The increase of product Al 2 O 3 strengthened the bonding of solder and Al 2 O 3 ceramic. To improve the mechanical behaviour of 2024 Al/Al 2 O 3 ceramic joints, SHBF160 glass powder was added to solder to strengthen the bonding between solder and Al 2 O 3 . The shear strength of 2024 Al/Al 2 O 3 ceramic joint increased to 69 MPa owing to the positive reinforcement of glass powder.

Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees

“…Nowadays, ultrasonic soldering technology has aroused ever-increasing attention and intense efforts (Zulkifli et al, 2019). Especially in electronic packaging industry, research mainly focus on metal substrates such as Al (Guo et al, 2017), Cu (Gan et al, 2019), ceramic materials igure 2 Soldering seam of joints by different ultrasonic loading degrees (Kolenak et al, 2021) or soldering of metals and ceramics (Yi et al, 2022;Li et al, 2022a). , the maximum shear strength of joint could reach 22.76 MPa under a 30 s ultrasonic-assisted time.…”