Investigation of non-uniform moisture distribution on determination of hygroscopic swelling coefficient and finite element modeling for a flip chip package

Zhou, Jiang; Lahoti, S.P.; Sitlani, M.P.; Kallolimath, Sharan; Putta, R.

doi:10.1109/esime.2005.1502784

Cited by 22 publications

(2 citation statements)

References 8 publications

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“…Generally, moisture diffusion in isotropic materials can be described by Fick's second law as follows [18,19]:…”

Section: Acknowledgmentmentioning

confidence: 99%

A Shear Strength Degradation Model for Anisotropic Conductive Adhesive Joints Under Hygrothermal Conditions

Tao¹,

Wu²,

Yin³

et al. 2013

Journal of Electronic Packaging

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Hygrothermal environments can degrade anisotropic conductive adhesive (ACA) joints by weakening the shear strength of adhesive interface. In this paper, the shear strength degradation model of ACA joints under hygrothermal conditions was formulated through experimental testing and theoretical modeling. The shear strength degradation data were obtained from different hygrothermal aging tests and the ACA moisture properties were characterized for the corresponding hygrothermal conditions. Theoretical models considering the hygrothermal factors of T (temperature), RH (relative humidity), and t (time), were used to fit the shear strength degradation data. It was found that the inverse exponential law was the best candidate model to predict the degradation data. The shear strength degradation model of ACA joints under hygrothermal conditions was proposed, where the relationship of the S (shear strength) and the hygrothermal factors (T, RH, and t) was expressed in an analytical model. The degradation model was validated by experiments, and the model predictions agreed well with the test results.

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“…Generally, moisture diffusion in isotropic materials can be described by Fick's second law as follows [18,19]:…”

Section: Acknowledgmentmentioning

confidence: 99%

A Shear Strength Degradation Model for Anisotropic Conductive Adhesive Joints Under Hygrothermal Conditions

Tao¹,

Wu²,

Yin³

et al. 2013

Journal of Electronic Packaging

View full text Add to dashboard Cite

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“…On the other hand, a finite element analysis (FEA) and computer simulation of the effects of adhesive Z-connections on the hygroscopic swelling of composites would make it possible to easily change the aforementioned design parameters and model their effects on thickness swelling. FEA has been used to model the hygroscopic swelling of wood and polymeric materials [22][23][24][25][26][27]. Hygroscopic swelling of wood is a physical phenomenon that couples moisture absorption and moisture-induced strain energy.…”

Section: Introductionmentioning

confidence: 99%

Finite Element Modelling of the Effect of Adhesive Z-Connections on the Swelling of a Laminated Wood Composite

Mazloomi,

He,

Evans

2023

J. Compos. Sci.

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This study used finite element analysis (FEA) to model the effects of adhesive Z-connections on the thickness swelling of laminated wood composites exposed to water. We hypothesized that the area density, diameter, and spatial distribution of adhesive Z-connections will influence the ability of Z-connections to restrain thickness swelling of the composites. We tested this hypothesis by modelling a wood composite in ANSYS FEA software v. 17.0 to explore the effect of moisture on the thickness swelling of the wood composite. The results were compared with those obtained experimentally. We then examined the effect of the area density, size (diam.), and spatial distribution of the adhesive Z-connections on the thickness swelling of wood composites. Our results showed a positive correlation between the number of adhesive Z-connections in the composites and restriction of thickness swelling following 72 h of simulated moisture diffusion. Similarly, increasing the size of adhesive Z-connections also restricted thickness swelling. In contrast, different spatial distributions of Z-connections had little effect on restraining thickness swelling. Our modelling approach opens up opportunities for more complex designs of adhesive Z-connections, and also to examine the effect of wood properties, such as permeability, density, and hygroscopic swelling ratios on the thickness swelling of laminated wood composites.

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Characterization and Modelling of Moisture Behaviour

Fan¹,

Zhang

Driel

et al. 2006

Solid Mechanics and Its Applications

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Investigation of non-uniform moisture distribution on determination of hygroscopic swelling coefficient and finite element modeling for a flip chip package

Cited by 22 publications

References 8 publications

A Shear Strength Degradation Model for Anisotropic Conductive Adhesive Joints Under Hygrothermal Conditions

A Shear Strength Degradation Model for Anisotropic Conductive Adhesive Joints Under Hygrothermal Conditions

Finite Element Modelling of the Effect of Adhesive Z-Connections on the Swelling of a Laminated Wood Composite

Characterization and Modelling of Moisture Behaviour

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