The room-temperature nitric acid (HNO3) compensation method is introduced to effectively improve the dielectric quality of ultrathin aluminum oxide (Al2O3) gate dielectrics under low thermal budget consideration. The physical properties, electrical characteristics, and temperature response of Al2O3 metal-oxide-semiconductor (MOS) devices without and with HNO3 compensation are compared. The surface roughness and interface trap density are obviously decreased by utilizing HNO3 compensation. Under negative gate bias, the leakage current, hard breakdown characteristics, and temperature-dependent reliability of the Al2O3 MOS(p) capacitors are clearly improved by HNO3 compensation. Under positive gate bias, the highly temperature-dependent current is principally dominated by generation-recombination mechanism. However, the diodes without HNO3 compensation show irregular temperature response especially at temperature above 70 °C. From Frenkel-Poole emission analysis, the oxide traps in Al2O3 without HNO3 compensation are responsible to this abnormal temperature response. These results suggest that the quality of ultrathin Al2O3 gate dielectrics can be cost-effectively improved by HNO3 compensation.