“…For its catastrophic consequence, electrostatic discharge (ESD) induced hard failures such as thermal breakdowns of microelectronic device and metal interconnect, have been well understood and drawn much attention of the researchers in the world [1,2,3,4,5,6,7,8]. Nevertheless, the problems of ESD induced soft failure such as performance degradation and increased leakage current, are still not fully comprehended and investigated [9,10,11,12].…”