2018
DOI: 10.1016/j.spmi.2018.07.023
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Investigation of pattern-orientation on stress in GaN grown on Si(111) substrate in lateral confinement epitaxy

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Cited by 4 publications
(1 citation statement)
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“…Si has many advantages as the substrate of GaN material, such as better crystallinity, large size, low cost, easy processing, good electrical conductivity, thermal conductivity and thermal stability and easy to make integrated circuits. But it is difficult to grow high-quality GaN epitaxial layer on Si substrate since there is a huge lattice mismatch and thermal mismatch between GaN and Si, this will cause cracks in the GaN epitaxial layer during the cooling process [4]. Because ZnO and GaN have the same lattice hexagonal wurtzite structure and the little lattice mismatch and thermal mismatch, ZnO can be used as a buffer layer for the growth of GaN thin films [5].…”
Section: Introductionmentioning
confidence: 99%
“…Si has many advantages as the substrate of GaN material, such as better crystallinity, large size, low cost, easy processing, good electrical conductivity, thermal conductivity and thermal stability and easy to make integrated circuits. But it is difficult to grow high-quality GaN epitaxial layer on Si substrate since there is a huge lattice mismatch and thermal mismatch between GaN and Si, this will cause cracks in the GaN epitaxial layer during the cooling process [4]. Because ZnO and GaN have the same lattice hexagonal wurtzite structure and the little lattice mismatch and thermal mismatch, ZnO can be used as a buffer layer for the growth of GaN thin films [5].…”
Section: Introductionmentioning
confidence: 99%