Investigation of process parameters in electroless copper plating on polystyrene

Dev, Atul; Tandon, Smriti; Jha, Pankaj Kumar; Singh, Prithipal; Dutt, Anup

doi:10.1007/s12046-020-01377-3

Cited by 6 publications

(3 citation statements)

References 15 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In this current study, xylitol, which is a natural polyhydroxylic compound could provide alternatives to EDTA, that is currently used as complexing agent in electroless baths. They form very stable complexes with copper (II) ions in alkaline solution (11,12) .…”

Section: Introductionmentioning

confidence: 99%

Effect of Active Dithiocarbamate Derivatives on Copper Nano Film Deposition

Balaramesh¹,

Jayalakshmi²,

Anitha³

et al. 2023

IJST

View full text Add to dashboard Cite

Objective:The coordination and electrochemistry-related effects and uses of piperidine dithiocarbamate (pipdtc) and piperazine dithiocarbamate (pzdtc) are the main topics of this article. Method: An environment friendly electroless bath was created using a very small amount of biodegradable methanesulphonic bronsted acid, Glyoxylic acid as a reducing agent, Xylitol as a non-toxic natural polyhydroxylic complexing agent and potassium hydroxide as pH modifier. Compact and finer deposits were obtained at pH 13.0 and 45 • C with an addition of 1 ppm of pipdtc and pzdtc in an optimized bath. Findings: The inhibiting effect of pipdtc and pzdtc additives depends on deposit properties, throwing power, thickness uniformity, surface tension and grain structure management. Novelty: In this electroless copper plating method, pipdtc and pzdtc improved the physical properties and produced quality deposits. Gravimetric and weight gain calculations were used to determine the physical parameters. AFM experiments were used to describe the surface morphologies of copper deposits. By using X-ray diffractogram (XRD) analysis, the copper deposits' crystallite sizes were quantified, and cyclic voltammetry analysis was used to assess their quality.

show abstract

Section: Introductionmentioning

confidence: 99%

Effect of Active Dithiocarbamate Derivatives on Copper Nano Film Deposition

Balaramesh¹,

Jayalakshmi²,

Anitha³

et al. 2023

IJST

View full text Add to dashboard Cite

show abstract

“…Several studies have sought to overcome this problem. For example, methods that add a filler to a resin matrix or apply a strong acid together with an organic solvent have been proposed for chemical etching [5][6][7][8][9][10]. Alternatively, presurface treatment (e.g., using UV irradiation) has been proposed as a physical etching process [11][12][13].…”

Section: Introductionmentioning

confidence: 99%

Effect of Polymer Substrate on Adhesion of Electroless Plating in Irradiation-Based Direct Immobilization of Pd Nanoparticles Catalyst

et al. 2022

View full text Add to dashboard Cite

Pd nanoparticles were directly immobilized on acrylonitrile–butadiene–styrene copolymer (ABS), acrylonitrile–styrene copolymer (AS), polystyrene (PS), polyphenylene sulfide (PPS), poly(vinyl chloride) (PVC), polypropylene (PP), and polyethylene (PE) polymer substrates via chemical reactions induced by ionizing irradiation. X-ray photoelectron spectroscopy analysis revealed that the chemical state of the immobilized Pd nanoparticles depended on the polymer substrate type. Electroless plating was performed using the immobilized Pd nanoparticles as the catalyst, and Cu-plating films were deposited on all polymer substrates. The results of the tape-peeling test suggested that the chemical state of the immobilized Pd nanoparticles on the polymer substrates affected the plating adhesion strength. Notably, ABS with immobilized Pd particles exhibited a high adhesion strength beyond the practical level, even without prior chemical etching. It was presumed that the high adhesion strength was owing to the anchoring effect of the holes generated on the ABS surface by ionizing irradiation.

show abstract

“…For the metal coating process, electro plating is the most supporting principle among all the available techniques. Owing to the pronounced physical and electrochemical properties, thin film coating technology has garnered significant attention in the field of electronic industry [1][2][3][4]. Electroless plating process has fulfilled the expected demand in the fabrication of decorative articles, semiconductors, integrated circuits and through-hole plating in the printed circuit boards [5][6][7][8].…”

Section: Introductionmentioning

confidence: 99%

Structural Properties of Mercapto Stabilizers on an Autocatalytic Pure Copper Metal Deposition

BalaRamesh¹,

Jayalakshmi

Anitha³

et al. 2022

IOP Conf. Ser.: Mater. Sci. Eng.

View full text Add to dashboard Cite

This article focuses on the effect of mercapto additives on electroless pure copper thin film deposition. The copper deposits produced by the autocatalytic bath comprising xylitol, glyoxylic acid, and potassium hydroxide as complexing agents, reducing agents, and pH adjusters, respectively, were of superior grade. pH 13.0 ± 0.25 and 45°C were ideal bathing conditions. In order to improve the thermal stability and the good take hold off with copper, a trace quantity of methanesulphonic acid was used. Nitrogen and sulphur containing heterocyclic compounds such as 2-mercaptopyridine and 2-mercaptopyrimidine were used as the bath stabilizers. 1 ppm of the mercapto stabilizers stabilizes the bath conditions and their inhibiting potential was studied. The influence of the fundamental bath parameters on autocatalytic pure copper deposition have been investigated in our study. Physical properties and stability were characterized by the gravimetric method. The diffraction method was used to examine the structural characteristics of the copper deposits.

show abstract

Investigation of process parameters in electroless copper plating on polystyrene

Cited by 6 publications

References 15 publications

Effect of Active Dithiocarbamate Derivatives on Copper Nano Film Deposition

Effect of Active Dithiocarbamate Derivatives on Copper Nano Film Deposition

Effect of Polymer Substrate on Adhesion of Electroless Plating in Irradiation-Based Direct Immobilization of Pd Nanoparticles Catalyst

Structural Properties of Mercapto Stabilizers on an Autocatalytic Pure Copper Metal Deposition

Contact Info

Product

Resources

About