Investigation of stress exponent in the room-temperature creep of Sn–40Pb–2.5Sb solder alloy

Mahmudi, R.; Rezaee-Bazzaz, A.; Banaie-Fard, H.R.

doi:10.1016/j.jallcom.2006.04.037

Cited by 55 publications

(26 citation statements)

References 33 publications

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“…The Q 3 decreased significantly to a strain value of 0.8 and insignificantly changed. The decrease in Q 3 with increasing strain is in agreement with [25,27,28,30]. The decreasing Q 3 value clearly indicates a decrease in the amount of stored energy in the material due to deformation [24,29].…”

Section: Compensation Of Strain Effectsupporting

confidence: 71%

“…Thus, the different superplastic deformation mechanisms can be associated with various n 2 values. According to [27,28], grain boundary sliding and dislocation viscous glide mechanism may lead to n values close to 2 and 3 respectively and the mechanisms related to n values in the range of 4 to 6 are associated with dislocation climb. The relationship between n 2 and the strain is consistent with the downward parabola.…”

Section: Compensation Of Strain Effectmentioning

confidence: 99%

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Modelling of the Superplastic Deformation of the Near-α Titanium Alloy (Ti-2.5Al-1.8Mn) Using Arrhenius-Type Constitutive Model and Artificial Neural Network

Mosleh

Mikhaylovskaya

Котов

et al. 2017

Metals

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Abstract:The paper focuses on developing constitutive models for superplastic deformation behaviour of near-α titanium alloy (Ti-2.5Al-1.8Mn) at elevated temperatures in a range from 840 to 890 • C and in a strain rate range from 2 × 10 −4 to 8 × 10 −4 s −1 . Stress-strain experimental tensile tests data were used to develop the mathematical models. Both, hyperbolic sine Arrhenius-type constitutive model and artificial neural-network model were constructed. A comparative study on the competence of the developed models to predict the superplastic deformation behaviour of this alloy was made. The fitting results suggest that the artificial neural-network model has higher accuracy and is more efficient in fitting the superplastic deformation flow behaviour of near-α Titanium alloy (Ti-2.5Al-1.8Mn) at superplastic forming than the Arrhenius-type constitutive model. However, the tested results revealed that the error for the artificial neural-network is higher than the case of Arrhenius-type constitutive model for predicting the unmodelled conditions.

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Section: Compensation Of Strain Effectsupporting

confidence: 71%

Section: Compensation Of Strain Effectmentioning

confidence: 99%

Modelling of the Superplastic Deformation of the Near-α Titanium Alloy (Ti-2.5Al-1.8Mn) Using Arrhenius-Type Constitutive Model and Artificial Neural Network

Mosleh

Mikhaylovskaya

Котов

et al. 2017

Metals

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“…29 Concerning the creep mechanisms, it has been suggested that dislocation viscous glide is characterized by a stress exponent of 5 at low temperatures, the activation energies being equal to dislocation pipe diffusion. 21,31 Climb of edge dislocations becomes the rate-controlling mechanism in pure metals at high temperatures with n values in the range of 4 to 6 and an activation energy that is equal to the activation energy for self-diffusion through the lattice. At lower temperatures, dislocation pipe diffusion becomes dominant, in which case, the n value increases to 7 and the activation energy reaches that of the activation energy for pipe diffusion.…”

Section: Resultsmentioning

confidence: 99%

“…This has been achieved using the impression creep testing technique, which has been widely used in the creep study of various solder materials. [17][18][19][20][21] EXPERIMENTAL PROCEDURE…”

Section: Introductionmentioning

confidence: 99%

Effects of Ag and Al Additions on the Structure and Creep Properties of Sn-9Zn Solder Alloy

Mahmudi

Geranmayeh

Noori

et al. 2008

Journal of Elec Materi

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Creep behavior of the eutectic Sn-9Zn, Sn-9Zn-0.5Ag, and Sn-9Zn-0.5Al solder alloys was studied by impression testing under constant punching stress in the range of 60 MPa to 130 MPa and at temperatures in the range of 298 K to 370 K. Analysis of the data showed that, for all loads and temperatures, Sn-9Zn-0.5Al had the lowest creep rates and thus the highest creep resistance among all materials tested. The creep resistance of Sn-9Zn-0.5Ag was slightly lower than that of the Al-containing alloy. The enhanced creep behaviors of the ternary alloys are attributed to the presence of AgZn 3 and very fine Zn particles, which act as the main strengthening agents in the Sn-9Zn-0.5Ag and Sn-9Zn-0.5Al alloys, respectively. Assuming a power-law relationship between the impression rate and stress, average stress exponents of 6.9, 7.1, and 7.2 and activation energies of 42.1 kJ mol -1 , 42.9 kJ mol -1 , and 43.0 kJ mol -1 were obtained for Sn-9Zn, Sn-9Zn-0.5Ag and Sn-9Zn-0.5Al, respectively. These activation energies are close to 46 kJ mol -1 for dislocation climb, assisted by vacancy diffusion through dislocation cores in the Sn. This, together with the stress exponents of about 7, suggests that the operative creep mechanism is dislocation climb controlled by dislocation pipe diffusion.

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“…Moreover, there are some empirical formulas. The logarithm relationship between the time and the stress are employed for solders by some researchers [4,14]. Feltham equation is also widely used for traditional metals [15,16].…”

Section: Introductionmentioning

confidence: 99%

Stress relaxation behavior of lead-free solder joint

Zhu

Gao

2015

J Mater Sci: Mater Electron

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In this work, stress relaxation behavior of Sn3.5Ag0.5Cu solder joint was investigated under 398 K. Three strain ranges (4, 6, and 8 %) and two strain rates (0.002 and 0.01/s) were utilized. The results show that the effect of strain range on stress relaxation is not significant under high strain rate. However, it firstly increases with strain range and then decreases after approaching the maximum value under low strain rate. Moreover, Stress relaxes more under high strain rate than that under low strain rate. Feltham equation can describe the stress relaxation behavior well under high strain rate. After a certain relaxation time, crack appears at the corner of the solder joint and the stress appears to increase a little.

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Investigation of stress exponent in the room-temperature creep of Sn–40Pb–2.5Sb solder alloy

Cited by 55 publications

References 33 publications

Modelling of the Superplastic Deformation of the Near-α Titanium Alloy (Ti-2.5Al-1.8Mn) Using Arrhenius-Type Constitutive Model and Artificial Neural Network

Modelling of the Superplastic Deformation of the Near-α Titanium Alloy (Ti-2.5Al-1.8Mn) Using Arrhenius-Type Constitutive Model and Artificial Neural Network

Effects of Ag and Al Additions on the Structure and Creep Properties of Sn-9Zn Solder Alloy

Stress relaxation behavior of lead-free solder joint

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