Investigation of surface integrity and material removal mechanism of single-crystal Si subjected to micro-laser-assisted machining

Geng, Ruwei; Yang, Xiaoning; Xie, Qiming; Zhang, Ruoyin; Zhang, Wanqing; Qiu, Hai; Mu, Rui; Yang, Weisheng; Rui, Li

doi:10.1016/j.infrared.2021.103868

Cited by 31 publications

(3 citation statements)

References 39 publications

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“…Micro-LAM Co. developed a commercial OPTIMUS T1 system [20,[84][85][86]. The OPTIMUS T1 system, as shown in figure 5(c), has been successful in achieving the optical machining of silicon with a surface roughness of 1.05 nm in Ra [87]. Additionally, germanium can retain surface roughness of less than 2 nm RMS using In-LAC method [85].…”

Section: Types Of Lacmentioning

confidence: 99%

Field-assisted machining of difficult-to-machine materials

Zhang,

Zheng,

Huang

et al. 2024

Int. J. Extrem. Manuf.

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Difficult-to-machine materials (DMMs) are extensively applied in critical fields such as aviation, national defense, biomedicine, and other key fields due to their excellent material properties. However, traditional machining technology is difficult to precisely machine DMMs due to poor surface quality and low processing efficiency. In recent years, as a new generation of machining technology, field-assisted machining (FAM) technology based on innovative principles such as laser heating, tool vibration, magnetic magnetization, and plasma modification provides a new solution for improving the machinability of DMMs. It is advantageous to prevent the shortcomings of traditional machining methods, and has become a hot topic of research in the domain of ultra-precision machining of DMMs. Many new methods and principles have been presented and investigated one after another, yet few researches have been analysed and summarized from a comprehensive standpoint. To fill this gap and understand the development trend of FAM, this study provides an important overview of FAM, covering different assisted machining methods, application effects, mechanism analysis, and equipment design. The current deficiencies and future challenges of FAM are summarized to lay the foundation for the further development of multi-field hybrid assisted and intelligent field-assisted machining technologies.

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Section: Types Of Lacmentioning

confidence: 99%

Field-assisted machining of difficult-to-machine materials

Zhang,

Zheng,

Huang

et al. 2024

Int. J. Extrem. Manuf.

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“…Considerable experimental efforts have been devoted to demonstrate the effectiveness of In-LAT in enhancing the machinability of monocrystalline silicon. Geng et al [14] observed that the surface roughness Ra of machined surface of monocrystalline silicon decreases from 3.03 nm in CT to 1.80 nm in In-LAT with 2.35 W laser assistance, but further increases to 8.03 nm at 4.79 W. And XRD analysis reveals a significant reduction in residual stress under the laser assistance. Ke et al [15] found that the utilization of laser assistance reduces the surface roughness Sa of monocrystalline silicon from 10 nm in CT to 5 nm in In-LAT.…”

Section: Introductionmentioning

confidence: 99%

“…Specifically, the laser beam is directed through the transparent single crystal diamond tool to precisely focus on the tool edge area, the resulting localized temperature field subsequently softens the material and promotes the ductile machinability of hard and brittle materials [6][7][8][9][10][11][12]. For instance, as compared to conventional turning (CT) of monocrystalline silicon, the In-LAT can increase the critical depth of cut (DOC) for brittleto-ductile transition (BDT) by 163% [13], reduce the surface roughness Ra by 59.4% [14], effectively diminish surface and subsurface damages [15], and substantially decrease the wear of diamond tool [16].…”

Section: Introductionmentioning

confidence: 99%

Finite element simulation and experimental investigation of in-situ laser-assisted diamond turning of monocrystalline silicon

Hu,

Zhao,

Sun

et al. 2024

Semicond. Sci. Technol.

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While the effectiveness of in-situ laser-assisted diamond turning (In-LAT) for promoting the ductile machinability of monocrystalline silicon has been demonstrated, the underlying cutting mechanisms remain inadequately understood. In this study, we investigate the fundamental mechanisms involved in the In-LAT of monocrystalline silicon by finite element simulations and experiments. Specifically, a finite element model of In-LAT of monocrystalline silicon is developed, which incorporates a Drucker-Prager constitutive model to address the brittle fracture of the material, as well as temperature-dependent materials properties to address the thermal softening effect. Furthermore, experiments of In-LAT of monocrystalline silicon are conducted with the self-developed In-LAT device, including tapering cutting and end face cutting. Simulation results demonstrate that In-LAT significantly increases the critical depth of cut for the brittle-to-ductile transition of monocrystalline silicon in tapering cutting mode by 72.2% compared to conventional cutting, accompanied with significantly reduced cutting forces, continuous chip profile and reduced surface brittle damage. The promotion of ductile machinability of monocrystalline silicon under In-LAT is attributed to the reduction and dispersion of stress in the cutting zone, which is in contrast to the significant stress concentration at the rake face and cutting edge in conventional cutting. And simulation results also provide an optimal temperature field of 900 K for the In-LAT of monocrystalline silicon, above which the excessive plastic flow accompanied by thermal accumulation results into deteriorated surface roughness. These findings provide valuable insights for understanding the cutting mechanisms of In-LAT and the parameter optimization for In-LAT application.

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Dielectric‐Based Metamaterials for Near‐Perfect Light Absorption

Wang,

Qin,

Duan

et al. 2024

Adv Funct Materials

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The emergence of metamaterials and their continued prosperity have built a powerful working platform for accurately manipulating the behavior of electromagnetic waves, providing sufficient possibility for the realization of metamaterial absorbers with outstanding performance. However, metamaterial absorbers composed of metallic materials typically possess many unfavorable factors, such as non‐adjustable absorption, easy oxidation, low‐melting, and expensive preparation costs. The selection of dielectric materials provides excellent alternatives due to their remarkable properties, thus dielectric‐based metamaterial absorbers (DBMAs) have attracted much attention. To promote breakthroughs in DBMAs and guide their future development, this work systematically and deeply reviews the recent research progress of DBMAs from four different but progressive aspects, including physical principles; classifications, material selections and tunable properties; preparation technologies; and functional applications. Five different types of theories and related physical mechanisms, such as Mie resonance, guided‐mode resonance, and Anapole resonance, are briefly outlined to explain DBMAs having near‐perfect absorption performance. Mainstream material selections, structure designs, and different types of tunable DBMAs are highlighted. Several widely utilized preparation methods for customizing DBMAs are given. Various practical applications of DBMAs in sensing, stealth technology, solar energy absorption, and electromagnetic interference suppression are reviewed. Finally, some key challenges and feasible solutions for DBMAs’ future development are provided.

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Investigation of surface integrity and material removal mechanism of single-crystal Si subjected to micro-laser-assisted machining

Cited by 31 publications

References 39 publications

Field-assisted machining of difficult-to-machine materials

Field-assisted machining of difficult-to-machine materials

Finite element simulation and experimental investigation of in-situ laser-assisted diamond turning of monocrystalline silicon

Dielectric‐Based Metamaterials for Near‐Perfect Light Absorption

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