2018 IEEE International Power Electronics and Application Conference and Exposition (PEAC) 2018
DOI: 10.1109/peac.2018.8590227
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Investigation of Temperature-Dependent Electrical Behavior and Trap Effect in AlGaN/GaN HEMT

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Cited by 3 publications
(2 citation statements)
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“…A new source and drain transient currents (I S and I D ) technique for a charge trapping characterization in AlGaN/GaN HEMTs, under normal device operation, has been developed. This proposed technique takes into account the device operating temperature variation during the transient measurements, a cost-effective complement to the temperature-dependent current-transient based techniques [6], [9], [23], [31]- [34]. It can be easily implemented to decouple the slow bulk charge traps and the surface traps from self-heating effects without turning to device simulations or to more complicated measurements.…”
Section: Discussionmentioning
confidence: 99%
“…A new source and drain transient currents (I S and I D ) technique for a charge trapping characterization in AlGaN/GaN HEMTs, under normal device operation, has been developed. This proposed technique takes into account the device operating temperature variation during the transient measurements, a cost-effective complement to the temperature-dependent current-transient based techniques [6], [9], [23], [31]- [34]. It can be easily implemented to decouple the slow bulk charge traps and the surface traps from self-heating effects without turning to device simulations or to more complicated measurements.…”
Section: Discussionmentioning
confidence: 99%
“…Combined with Figures 6 and 7, or analysis, the breakdown occurs in the AlGaAs/InGaAs heterojunction and Schottky junction, the gate becomes a high-voltage terminal, and the drain becomes a low-voltage terminal, causing a gradual decrease in output current. In addition, as the carrier mobility lowers, the transconductance G m also decreases, leading to a lessening of gate control capability [27], as shown in Figure 10. Thus, the gain of the device decreases due to the positive correlation with transconductance G m , so the phenomenon of gain compression emerges, as shown in Figure 11.…”
Section: Uwb Emp Failure Mechanism Analysismentioning
confidence: 99%