Investigation of the de-embedding issue of CPWs on silicon substrates at high frequency

Shu, Wen; Shichijo, Sam; Henderson, Rashaunda

doi:10.1109/wmcas.2013.6563571

Cited by 2 publications

(1 citation statement)

References 6 publications

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“…The traditional open-short de-embedding method has been proven to be unsuitable to ultra-high frequencies due to its incapability for dealing with distributed nature in millimeter-wave frequency range based on assumptions of lumped equivalent circuit and ideal dummy patterns [16,17]. On the other hand, based on cascading distributive assumption, multi-line methods, including L-2L [18,19,20,21], and thru-based approaches such as thru-only [22], have been widely used for on-chip transmission line de-embedding [23,24]. The targets of the transmission line de-embedding include the determination of complex propagation constant and characteristic impedance.…”

Section: Introductionmentioning

confidence: 99%

Analysis of the parameter extraction for on-chip transmission lines

Yang

Zhang

et al. 2020

IEICE Electron. Express

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Matching networks for ultra-high frequency chips are susceptible, and accurate extraction of passive devices parameters is essential. For on-chip transmission lines, the authors present a precise method of extracting transmission line propagation constant from two transmission line measurement structures with different lengths. After obtaining the propagation constant based on this method, to get the transmission line's characteristic impedance, this paper conducts a Y-Z model analysis of the signal pad and gives mathematical expressions. This approximation method can obtain the characteristic impedance of the transmission line without solving the signal pad's model parameters. The propagation constant and characteristic impedance derived from the methods proposed are compared with the corresponding electromagnetic simulation results, achieving fairly good agreement from 250 MHz to 110 GHz.

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