Micro‐damage mechanisms in a semicrystalline polyamide 6 polymer are characterized by in situ synchrotron radiation computed laminography (SRCL) using compact‐tension like specimens with a notch root radius of 0.25 mm. SRCL allows the quantification of cavity nucleation, growth, and coalescence in flat 2 mm thick notched specimens with a micrometer resolution in 3D (under conditions of severe stress triaxiality) during the in situ loading. The maximum damage occurred at mid‐thickness and was located at a small distance ≈ 200 µm from the notch root. It is shown that damage is distributed in distinct zones, which can be linked to different stress triaxiality states. Penny‐shaped cracks are found after some loadings and their diameters are a function of the distance to the notch root. In a layer of about 33 µm no damage was found. In the adjacent 128 µm layer, penny‐shaped cracks are found with diameters of the order of average spherulite sizes (4–6 µm). In the next region, 30–45 µm long cracks are found corresponding to several average spherulite diameters. During propagation, tunnel‐like cracks are formed ahead of the main crack. Finally, crack initiation location is found to be largely dependent on the roughness of the machined notch surface by comparing two samples with the same loading conditions.