To solve
the problems of a conventional subtractive process for preparing conductive
circuits, numerous alternative additive processes have been investigated,
such as screen or inkjet printing, selective electroless plating,
laser-induced forward transfer, etc. They all lead to a simpler procedure,
less pollution, and finer line width but are still faced with difficulties
like low conductivity and thickness, poor adhesion, and high cost.
PDMS is a kind of material with low surface energy, leading to low
adhesion with adhesive. Under these circumstances, a simple template
transfer process for additively preparing conductive circuits is reported.
The process to form the template includes the preparation of a photolithographic
mask on the carrier copper foil and adsorption of PDMS anti-adhesion
coating. Followed by metal deposition through electroplating on the
template, the conductive circuits are transferred to the target substrate.
Thus, the designed conductive circuits on various substrates including
paper and cloth are formed. The template can be used again after being
reimmersed into PDMS anti-adhesion coating. The components and the
concentration of the coating are carefully discussed, and the mechanism
of anti-adhesion is also researched by EIS and XPS. The copper circuits
show a line width of 10 μm, a peeling strength of 7.11 N/cm,
and a resistivity of 1.93 μΩ·cm, which is similar
to that of bulk copper. With low pollution and cost, high versatility,
and good electrical and adhesion performance, the template transfer
process shows a good application prospect in the large-scale production
of flexible electronics like sensors, RFID tags, etc.