Investigation of the short-time high-current behavior of vias manufactured in hybrid thick-film technology

Ortolino, Dominique; Kita, Jarosław; Wurm, Roland; Blum, Emmanuel; Beart, Karin; Moos, Ralf

doi:10.1016/j.microrel.2011.02.025

Cited by 4 publications

(1 citation statement)

References 14 publications

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“…3. Generally, filling of the vias in unfired tapes or laminates is more difficult than the via-filling process known from conventional hybrid thick-film technology (Ortolino et al, 2011). The main problem is that, when filling the laminated green sheets, solvents of pastes diffuse rapidly into the green sheets and the paste dries out before filling is completed.…”

Section: Fabrication Of the Sensormentioning

confidence: 99%

Platform to develop exhaust gas sensors manufactured by glass-solder-supported joining of sintered yttria-stabilized zirconia

Schubert

Wollenhaupt

Kita

et al. 2016

J. Sens. Sens. Syst.

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Abstract.A manufacturing process for a planar binary lambda sensor is shown. By joining the heating and the sensing components via glass soldering with a joining temperature of 850 • C, a laboratory platform has been established that allows the manufacturing of two independent parts in high-temperature co-fired ceramics technology (HTCC) with electrodes that are post-processed at lower temperatures, as is required for mixedpotential sensors. The final device is compared to a commercial sensor with respect to its sensing performance. Important processes and possible origins of problems as well as their solutions during sensor development are shown, including heater design and joining process.

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Section: Fabrication Of the Sensormentioning

confidence: 99%