Investigation of the Stress-Strain State of a Rectangular Plate after a Temperature Shock

Abstract

In this paper, the temperature shock phenomenon is considered. This phenomenon occurs during the operation of engineering structures on Earth and in outer space. A rectangular plate has been selected as a structural element exposed to temperature shock. It has a rigidly sealed edge and three free edges. A one-dimensional third initial boundary value problem of thermal conductivity was posed and solved to study the stress–strain state of the plate. Fourier’s law was used to solve this problem, taking into account the inertial term, since the temperature shock is a fairly fast-dynamic phenomenon. It was believed that all the thermophysical properties of the plate are constant and do not depend on its temperature. As a result, the temperature field of the plate was obtained after the temperature shock. This temperature field generates temperature stresses inside the plate, which lead to temperature deformations. To determine these deformations, the initial boundary value problem of thermoelasticity was posed and solved in this work. The Sophie Germain equation was used while solving this problem. To describe the plate, the theory of flexible plates was used, taking into account the stresses in the middle surface of the plate. Next, the accuracy of analytical solutions for the points displacement of a homogeneous plate subjected to a temperature shock was investigated. The temperature field was constructed using a numerical simulation. Functions of the displacement vector components were obtained using approximate analytical solutions. The accuracy of approximate analytical solutions for the components of the plate points deformation vector was estimated. The obtained results allow us to describe the stress–strain state of the plate after the temperature shock. The results of this work can be used in the design of engineering structures for both terrestrial and space purposes in terms of stability calculations and the implementation of deformation constraints.

Method of taking into account influence of thermal shock on dynamics of small satellite and its use in analysis of microaccelerations

“…The results presented in [16,31,33] were obtained using a computational experiment in the ANSYS. The results presented in Figure 6 were obtained using approximate analytical dependences ( 7) and ( 8) presented in [30]. Therefore, it can be argued that these dependences are correctly applied in a onedimensional heat conduction model.…”

“…To simulate the effect of thermal shock in an asymmetric scheme (Figure 2a), we will choose a small satellite for remote sensing of the Earth EO-1 [32]. The main parameters of EO-1 are presented in Table 1 In the article [30], a one-dimensional problem of thermoelasticity was presented: All parameters included in the system of equations ( 1)-( 6) are presented in Table 1.…”

“…In the one-dimensional problem of thermoelasticity, deflection is considered as a function of two variables (Figure 3). In the research [30], an approximate analytical solution was obtained for the one-dimensional thermoelasticity problem (1)-( 6) in the following form:…”

“…In this case, it was proposed in the research [30] to approximate the temperature field within a one-dimensional model of thermal conductivity by the following dependence:…”

“…To choose a strategy for taking into account the effect of thermal shock, it is necessary to analyze the design of a small satellite. The variety of forms of small satellites suggests the use of various models for assessing the effect of tehermal shock [29,30]. Figure 2 If a small satellite has one large elastic element (Figure 2 a), then the model for taking into account the influence can be expressed using the approximate dependences of the displacement vector components presented in the research for a one-dimensional heat conduction model [29].…”