Investigation of Thermal Conductivity of Nanostructures Using A Mathematical Model

Juraev, H. S.; Juraeva, G.H.

doi:10.1088/1742-6596/2270/1/012015

Cited by 2 publications

(1 citation statement)

References 20 publications

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“…This work offers a methodology for the independent control of electron and phonon transport using nanostructured materials, which can provide thermo-electric Si-based materials that are compatible with large scale integrated circuit processing technologies. Juraev and Juraeva [24] pointed out that the transfer of heat through nanostructures differs significantly from the corresponding processes inside macroscopic bodies. Various research methods, both theoretical and experimental, are applied to such objects.…”

Section: Introductionmentioning

confidence: 99%

Thermal Conductivity of Nanostructure in Microelectronic Equipment and the Enhancement of Its Thermo-Physical Properties

Li¹,

Jing²,

Liu³

et al. 2022

IJHT

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To optimize the heat dissipation performance of microelectronic equipment, optical instrument, and optoelectronic devices, it’s necessary to explore the heat transfer mechanism of the nanostructure in them, however, due to the limitation of the research objects, there isn’t a uniform simulation method for the thermo-physical properties of such nanostructure. Therefore, this paper aims to study the thermo-physical properties of nanostructure in microelectronic equipment. At first, by structuring Si super lattice nanowires in a specific direction and then using the Ge atoms to replace the Si atoms in the nanowires, this paper built a model for the periodic Si/Ge super lattice nanowires. Then, this paper performed integral operation on the dynamic equations of the two types of atoms using the time integration algorithm to attain the trajectories of Si and Ge atoms in the nanowire structure of the microelectronic equipment, and discussed the influence of the size and geometrical shape of the cross section of nanowires on thermal conductivity. After that, this paper simulated the structure of the nano-scale SiC material, selected appropriate cut-off radius, and optimized the structure of the nanostructure model based on the Discover Minimization module. At last, the thermal conductivity of the nanostructure was calculated and its thermo-physical properties were analyzed.

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Section: Introductionmentioning

confidence: 99%

Thermal Conductivity of Nanostructure in Microelectronic Equipment and the Enhancement of Its Thermo-Physical Properties

Li¹,

Jing²,

Liu³

et al. 2022

IJHT

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Research of the Stationary Phenomenon of Heat Transfer in a Spherical Condensed Media

Juraev,

Juraeva

2024

tnusns

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A method for investigating approximate analytical solutions of boundary value problems of singularly perturbed equations of stationary heat transfer processes in a spherical condensed medium, close to solving the boundary value problem for an undisturbed equation, is presented. The main task in which the structure of the article is defined is the development of mathematical and computer models of the stationary phenomenon of heat transfer in flat condensed media and a model of diffusion-reactive energy transfer depending on the thermal conductivity of materials.

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Investigation of Thermal Conductivity of Nanostructures Using A Mathematical Model

Cited by 2 publications

References 20 publications

Thermal Conductivity of Nanostructure in Microelectronic Equipment and the Enhancement of Its Thermo-Physical Properties

Thermal Conductivity of Nanostructure in Microelectronic Equipment and the Enhancement of Its Thermo-Physical Properties

Research of the Stationary Phenomenon of Heat Transfer in a Spherical Condensed Media

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