“…To minimize the presence of trap states, it is necessary to reduce the density of structural defects in the active layer of OPV devices. This requires a careful optimization of the stacking properties of organic molecules in the active layer. , Existing studies have demonstrated that the use of high-boiling-point solvents with a lower evaporation rate is an effective approach to achieve a more desired molecular stacking structure, thereby reducing the density of structural defects. − For instance, Hu et al reported that compared to low-boiling-point carbon disulfide solvents, the utilization of high-boiling-point ortho-dichlorobenzene as a processing solvent for P3HT:PCBM active layers allows sufficient time for self-organization during a gradual drying process, resulting in less structural defects and the formation of the optimal active layer morphology . Therefore, to mitigate the influence of trap-assisted recombination, limiting the performance of OPV devices under low illumination intensities, we intend to employ a commonly used high-boiling-point solvent for device fabrication.…”