Investigation on Advanced Cold Plate Liquid Cooling Solution for Large Scale Application in Data Center

Tan, Xianguang; Li, Hongmei; Zhang, Jiajun; Tian, Wenbin; Yu, Jiadi; Ruan, Xingping; Wang, Baolin; Wu, Liang; Zhang, Jun; Ahuja, Nishi

doi:10.1109/itherm55368.2023.10177559

Cited by 2 publications

(2 citation statements)

References 12 publications

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“…However, the study also pointed out the complexities involved in integrating these systems into existing data center infrastructures, including challenges related to system design, coolant distribution, and leakage detection. Tan et al (2023) conducted an investigation on advanced cold plate liquid cooling solutions for large-scale applications in data centers. Similar to Gui et al, this study highlighted the limitations of conventional air-cooling methods in handling the high Thermal Design Power (TDP) of modern processors.…”

Section: Technical and Materials Limitationsmentioning

confidence: 99%

“…The study underscores the importance of smart energy management in controlling multiple cooling modules and mini heat exchangers, on real-time temperature monitoring. Tan et al (2023) investigated an advanced cold plate liquid cooling solution for large-scale applications in data centers. The study addressed the challenges posed by the high Thermal Design Power (TDP) of modern processors, which traditional air-cooling solutions struggle to manage.…”

Section: Economic Feasibility and Scalabilitymentioning

confidence: 99%

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Sustainable cooling solutions for electronics: A comprehensive review: Investigating the latest techniques and materials, their effectiveness in mechanical applications, and associated environmental benefits

Peter Efosa Ohenhen,

Onyinyechukwu Chidolue,

Aniekan Akpan Umoh

et al. 2024

World J. Adv. Res. Rev.

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This study presents a comprehensive review of the latest techniques and materials in sustainable cooling solutions for electronic systems, focusing on their effectiveness in mechanical applications and associated environmental benefits. The primary aim is to assess the current state and future prospects of sustainable cooling technologies, highlighting their role in addressing thermal management challenges while minimizing environmental impacts. The methodology adopted is a systematic literature review, drawing data from peer-reviewed academic journals, conference proceedings, and industry reports. The search strategy involved keyword searches, database filtering, and reference tracking, with a focus on recent advancements in cooling technologies and their environmental implications. Key findings reveal a significant shift from traditional cooling methods to innovative, environmentally friendly solutions. Advanced materials like phase-change materials and nanotechnology-based heat sinks, along with techniques such as liquid cooling and thermoelectric cooling, have emerged as effective solutions. These technologies offer improved thermal management, reduced carbon footprints, and enhanced resource efficiency. The future landscape of sustainable electronic cooling is expected to be shaped by smart technologies, new materials with superior thermal properties, and the integration of renewable energy sources. The study concludes with strategic recommendations for industry stakeholders and policymakers, emphasizing the need for fostering innovation, promoting green cooling solutions, and setting stringent environmental standards. Future research directions include exploring new materials and technologies, integrating cooling systems with renewable energy, and conducting lifecycle analyses to understand the environmental impact of these technologies fully. This study underscores the critical role of sustainable cooling technologies in achieving environmental sustainability in electronic systems.

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Section: Technical and Materials Limitationsmentioning

confidence: 99%

Section: Economic Feasibility and Scalabilitymentioning

confidence: 99%