“…The insertion of additively manufactured 3D pins into a composite substrate can lead to defects such as in-plane ber crimping and the formation of resin-rich regions [23,18], similar to those encountered in z-pinning, which is an established technique in the eld of composite materials [24,25]; these defects are localized in a limited region surrounding the pin, impacting the original ber-polymer distribution and locally affect the mechanical properties of the substrate [26,27]. Reducing the diameter of the z-pin in the range of 0.3 mm ÷ 0.5 mm has been proven to provide a strategic pathway to mitigate those defects, as suggested by several recent researches [28][29][30]. To date, proposed LPBF AM 3D pins are mainly cylindrical [13,14,26,31], with a diameter in the range of 1.00 mm ÷ 1.5 mm [13-15, 26, 31, 32].…”