In this research, the size effect in the micro-upsetting process of oxygen-free high conductivity copper has been investigated numerically and experimentally. For the numerical part of this study, the crystal plasticity finite element (CPFE) method was employed and grains were produced using the Voronoi algorithm. The homogenization method was used for curve fitting and to obtain the material-hardening parameters. Then, simulation of the micro-upsetting process was carried out using a VUMAT subroutine which was written to implement crystal plasticity formulation. The micro-upsetting process was carried out at compression deformation of 50% for parts with diameters 0.75, 1 and 2 mm and height ratio of 1.5. Comparison of the data obtained from the CPFE and experimental procedures indicated a remarkable agreement. The results showed that, by increasing grain size from 30 to 60 μm, the forming forces for the diameters 0.75, 1 and 2 mm reduce by 12.3%, 6.8% and 6.7%, respectively, admitting the Hall–Petch equation. Also, according to the results obtained for constant grain sizes, when sample dimensions decrease, the stress–strain curve of the micro-upsetting process shows a downward shift which happens due to the increase in the grain size ratio and size effect. For the first time, investigation of the barrel shape and end surface geometry obtained from simulations and experimental tests shows distortion in the boundaries of both the modeled and fabricated specimens. Therefore, in micro-sized parts, the grain size has a greater effect on behavior of the material and geometrical accuracy.