Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon

Shen, Jianyun; Zhu, Xu; Chen, Jianbin; Tao, Pengcheng; Wu, Xian

doi:10.3390/mi10090616

Cited by 10 publications

(2 citation statements)

References 33 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…UV-DWS is widely used as an advanced machining technique for the processing of hard and brittle materials [ 157 ]. The utilization of ultrasonic vibration in machining technology offers the benefit of creating intermittent contact between the workpiece and the tool [ 158 ].…”

Section: Hybrid Machiningmentioning

confidence: 99%

Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon

Zhou³

et al. 2023

Micromachines

View full text Add to dashboard Cite

Due to the brittleness of silicon, the use of a diamond wire to cut silicon wafers is a critical stage in solar cell manufacturing. In order to improve the production yield of the cutting process, it is necessary to have a thorough understanding of the phenomena relating to the cutting parameters. This research reviews and summarizes the technology for the precision machining of monocrystalline silicon using diamond wire sawing (DWS). Firstly, mathematical models, molecular dynamics (MD), the finite element method (FEM), and other methods used for studying the principle of DWS are compared. Secondly, the equipment used for DWS is reviewed, the influences of the direction and magnitude of the cutting force on the material removal rate (MRR) are analyzed, and the improvement of silicon wafer surface quality through optimizing process parameters is summarized. Thirdly, the principles and processing performances of three assisted machining methods, namely ultrasonic vibration-assisted DWS (UV-DWS), electrical discharge vibration-assisted DWS (ED-DWS), and electrochemical-assisted DWS (EC-DWS), are reviewed separately. Finally, the prospects for the precision machining of monocrystalline silicon using DWS are provided, highlighting its significant potential for future development and improvement.

show abstract

Section: Hybrid Machiningmentioning

confidence: 99%

Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon

Zhou³

et al. 2023

Micromachines

View full text Add to dashboard Cite

show abstract

“…Although perfect Mono-Si crystals can be produced through Floating Zone [ 3 ] or Czochralski [ 4 ] methods, traditional mechanical experiments are still difficult to execute due to the inherent brittleness of silicon. Moreover, the produced Mono-Si wafers have also exhibited edge collapse, hidden cracks and subsurface damage [ 5 , 6 ] in wiresaw cutting, which have slowed its commercial expansion in the photovoltaic industry. Therefore, learning the mechanical properties of silicon is still highly desirable, more and more efforts have been continuously carried out to solve these problems.…”

Section: Introductionmentioning

confidence: 99%

Revisiting the Rate-Dependent Mechanical Response of Typical Silicon Structures via Molecular Dynamics

Liu

Wan

et al. 2022

Nanomaterials

View full text Add to dashboard Cite

Strain rate is a critical parameter in the mechanical application of nano-devices. A comparative atomistic study on both perfect monocrystalline silicon crystal and silicon nanowire was performed to investigate how the strain rate affects the mechanical response of these silicon structures. Using a rate response model, the strain rate sensitivity and the critical strain rate of two structures were given. The rate-dependent dislocation activities in the fracture process were also discussed, from which the dislocation nucleation and motion were found to play an important role in the low strain rate deformations. Finally, through the comparison of five equivalent stresses, the von Mises stress was verified as a robust yield criterion of the two silicon structures under the strain rate effects.

show abstract