Investigation on the electromagnetic centring technique in compressor with labyrinth seal structure

Zhang, W; Feng, Chun Lan; Cheng, Junming; Feng, Qian; Wu, Weifeng

doi:10.1088/1757-899x/232/1/012072

Cited by 12 publications

(15 citation statements)

References 7 publications

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“…Since the experimental design and results conform to percolation theory, we try but failure to fit the data using κ – κ f ( f – f p ) n . [ 48,50 ] However, the cubic polynomial can fit with the SD data well, as shown by the dotted lines in Figure 7A. Therefore, it is suggested that a percolation model with a power n of 3 can be used for Si 3 N 4w /silicone rubber.…”

Section: Resultsmentioning

confidence: 98%

Thermal and dielectric multiple percolation in α‐Si₃N₄ whiskers/silicone rubber

Zhang

Liu

Yang

et al. 2023

Polymer Engineering & Sci

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Currently, thermal interfacial materials (TIMs) play a great role to electronic and semiconductor devices working at high voltage, power and frequency. The urgent need for electrical insulating TIMs and relevant theory are not addressed yet. This study adopted an electrical insulating α‐Si3N4 whisker as a filler to prepare Si3N4w/silicone rubber. The results show that the elongation at break and thermal conductivity of silicone rubber are promoted from 91.6% and 0.343 to 402.9% and 1.011 W m−1 K−1, respectively, at a filler fraction of 8.0 vol%. It reveals a multiple percolation phenomenon which has not been previously observed in an electrical insulating TIMs. The thermal percolation threshold is decreased to 4.0 vol% with increasing aspect ratio of the whisker. The behavior of the dielectric strength is explained by a double percolation model. A phonon quasi‐ballistic transportation mechanism based on Coulomb interactions is proposed for the TIMs.

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Section: Resultsmentioning

confidence: 98%

Thermal and dielectric multiple percolation in α‐Si₃N₄ whiskers/silicone rubber

Zhang

Liu

Yang

et al. 2023

Polymer Engineering & Sci

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“…Computer simulation and machine learning are powerful tools to build new heat conduction models and design the next generation of thermally conductive products. (v)The λ values of polymer composites obtained with different testing equipment show obvious differences. Characterization methods for thermal conductivity need to be normalized and standardized to make the λ values comparable. (vi)Smart materials are developing rapidly, designing and preparing functional thermally conductive materials is becoming increasingly important, such as thermal conducting material with efficient EMI shielding, thermal conducting material with rapid self‐healing capability, [ 103,399,400 ] and thermal conducting material with sensing capabilities, etc.…”

Section: Discussionmentioning

confidence: 99%

“…In contrast, hydrogen bonds and van der Waals forces (two main types of typical noncovalent bonds) can improve thermal conductivity by restricting the twisting motion of molecular chains and the formation of disordered structures, thus improving polymer crystallinity. [ 103,117 ] It has been shown that the increase in the number and strength of hydrogen bonds affects the final thermal conductivity of polymers. Mehra et al.…”

Section: Critical Factors For the Thermal Conductivity Of Polymers Co...mentioning

confidence: 99%

“…[ 380 ] The interface in composite materials usually includes the following parts: the original contact area between the polymer and the fillers, the solid‐liquid layer formed by diffusion between the polymer and the fillers, and the surface coating introduced by the surface modification of the fillers. [ 103,381 ] Hence, the chemical composition and structure of the interfaces in polymer composites are often intricate. There are three main properties observed in interfaces, which are: transmission, blocking, scattering, and absorption.…”

Section: Critical Factors For the Thermal Conductivity Of Polymers Co...mentioning

confidence: 99%

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A Roadmap Review of Thermally Conductive Polymer Composites: Critical Factors, Progress, and Prospects

Wang

Weng

et al. 2023

Adv Funct Materials

104

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Recently, the need for miniaturization and high integration have steered a strong technical wave in developing (micro‐)electronic devices. However, excessive amounts of heat may be generated during operation/charging, severely affecting device performance and leading to life/property loss. Benefiting from their low density, easy processing and low manufacturing cost, thermally conductive polymer composites have become a research hotspot to mitigate the disadvantage of excessive heat, with potential applications in 5G communication, electronic packaging and energy transmission. By far, the reported thermal conductivity coefficient (λ) of thermally conductive polymer composite is far from expectation. Deeper understanding of heat transfer mechanism is desired for developing next generation thermally conductive composites. This review holistically scopes current advances in this field, while giving special attention to critical factors that affect thermal conductivity in polymer composites as well as the thermal conduction mechanisms on how to enhance the λ value. This review covers critical factors such as interfacial thermal resistance, chain structure of polymer, intrinsic λ value of different thermally conductive fillers, orientation/configuration of nanoparticles, 3D interconnected networks, processing technology, etc. The applications of thermally conductive polymer composites in electronic devices are summarized. The existing problems are also discussed, new challenges and opportunities are prospected.

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“…[ 10–12 ] In order to form heat‐transfer path under low filler concentrations, significant efforts have been made to construct 3D filler networks within polymer composites, wherein all the fillers theoretically contact with each other (commonly edge‐to‐face contact for 2D fillers) and participate in the formation of a thermally conductive network, thus improving the TC. [ 13–17 ] Moreover, graphene is considered the optimal 2D filler for constructing 3D thermally conductive networks and is expected to further increase the TC of polymer composites owing to its extremely high intrinsic TC (≈5000 W (m K) −1 ) and large aspect ratio. [ 18–20 ] Liu et al.…”

Section: Introductionmentioning

confidence: 99%

Nerve‐Fiber‐Inspired Construction of 3D Graphene “Tracks” Supported by Wood Fibers for Multifunctional Biocomposite with Metal‐Level Thermal Conductivity

Zhang

Gao

et al. 2023

Adv Funct Materials

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Given the rapid developments in modern electronics, there is an urgent need for polymer composites with excellent heat-dissipating capabilities to address the cooling problem of these devices. However, designing a highly thermally conductive polymer composite that can outperform metals and ceramics while also exhibiting high processability and low cost remains a challenge. Herein, inspired by the fibrous pathway of human nervous system, natural wood fibers (WFs) are used as the template and coated with graphene nanoplates (GNPs) via a simple electrostatic self-assembly approach. Subsequent hot-pressing process yields "core-sheath" microstructured fibers, wherein the GNPs are compactly contacted face to face and arranged along the surfaces of the fibrous WF "cores". This WF@G biocomposite consists of highly efficient 3D fibrous "tracks" for heat transmission, resulting in an extremely high thermal conductivity of 134 W (m K) −1 , which is at par with those of many metals. It also exhibits several other desirable properties and functionalities, including high mechanical strength and excellent flame resistance as well as remarkable electromagnetic shielding and Joule heating performances, which has significant potential for use as a functional thermal management material (TMM). Hence, this study describes a simple yet scalable manufacturing technique for the development of advanced metal-level biomass-based TMMs.

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Investigation on the electromagnetic centring technique in compressor with labyrinth seal structure

Cited by 12 publications

References 7 publications

Thermal and dielectric multiple percolation in α‐Si₃N₄ whiskers/silicone rubber

Thermal and dielectric multiple percolation in α‐Si₃N₄ whiskers/silicone rubber

A Roadmap Review of Thermally Conductive Polymer Composites: Critical Factors, Progress, and Prospects

Nerve‐Fiber‐Inspired Construction of 3D Graphene “Tracks” Supported by Wood Fibers for Multifunctional Biocomposite with Metal‐Level Thermal Conductivity

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Investigation on the electromagnetic centring technique in compressor with labyrinth seal structure

Cited by 12 publications

References 7 publications

Thermal and dielectric multiple percolation in α‐Si3N4 whiskers/silicone rubber

Thermal and dielectric multiple percolation in α‐Si3N4 whiskers/silicone rubber

A Roadmap Review of Thermally Conductive Polymer Composites: Critical Factors, Progress, and Prospects

Nerve‐Fiber‐Inspired Construction of 3D Graphene “Tracks” Supported by Wood Fibers for Multifunctional Biocomposite with Metal‐Level Thermal Conductivity

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Thermal and dielectric multiple percolation in α‐Si₃N₄ whiskers/silicone rubber

Thermal and dielectric multiple percolation in α‐Si₃N₄ whiskers/silicone rubber