Investigation on the Microstructure, Interfacial IMC Layer, and Mechanical Properties of Cu/Sn-0.7Cu-xNi/Cu Solder Joints

Yang, Li; Ge, Jijiang; Zhang, Yaocheng; Dai, Jun; Xiang, Jicen

doi:10.1007/s11664-016-4509-2

Cited by 9 publications

(2 citation statements)

References 27 publications

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“…Increasing the amount of Ni also decreases the void percentage and Cu 3 Sn growth in Sn-Cu solder alloy [13]. The tensile properties and wettability in solder joints with Cu also improved as a result of adding 0.05 wt.% Ni [14]. The addition of 0.05 wt.% Ni to Sn-0.7Cu solder was shown to effectively reduce the formation of intermetallic compound (IMC) layer at the interface during the reflow process and for inhibiting the growth of IMC during the aging process [15].…”

Section: Introductionmentioning

confidence: 87%

Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution

Guerrero

Camacho

Mokhtari

et al. 2018

International Journal of Corrosion

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The corrosion and leaching behaviour of a new ternary Sn-0.7Cu-0.05Ni alloy in 3.5 wt.% NaCl solution is reported herein. Potentiodynamic polarization measurements show that Sn-0.7Cu-0.05Ni has the highest corrosion rate. Results of the 30-day Sn leaching measurement show that Sn-Cu-Ni joint has slight decrease attributed to the formation of thin passivation film after 15 days. The leaching amounts of Sn are observed to be higher in solder joint than in solder alloy due to the galvanic corrosion happening on the surface. EDS and XRD results of the corroded surface confirm that the corroded product is made up of oxides of tin.

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Section: Introductionmentioning

confidence: 87%

Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution

Guerrero

Camacho

Mokhtari

et al. 2018

International Journal of Corrosion

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“…However, due to the disadvantages of wettability or the mechanical properties of these alloys, scholars have been dedicated to finding new solder alloys to meet the ever increasing demands of the electronics industry. Modification with an alloying element is a useful method, and the elements of Ag, In and Ni [9][10][11][12][13][14][15][16] or even rare-earth elements 17) were added into the solder alloys.…”

Section: Introductionmentioning

confidence: 99%

Influence of ZnO nanoparticle addition on interfacial intermetallic compound evolution in Sn-3.0Ag-0.5Cu solder joints

Qu¹,

Cao²,

Cui³

et al. 2019

Jpn. J. Appl. Phys.

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The effect of ZnO nanoparticles on intermetallic compound (IMC) layer in solder joints was investigated by comparing plain Sn-3.0Ag-0.5Cu (SAC305) and Sn-3.0Ag-0.5Cu + 0.5ZnO composite solder during isothermal aging. It was shown that the morphology of the IMC layer in composite solder is flatter and the thickness of the IMC layer solder was thinner than the composite solder. The wettability was better and the melting point was not changed distinctly by adding ZnO nanoparticles into the SAC305 solder. The diffusion coefficients of plain SAC305 and composite solder were calculated and were 0.28 and 0.151 μm 2 h −1 , respectively. Furthermore, the activation energy of composite solder is higher, and it was indicated that the activation energy dominated the growth of the IMC layer in solder during aging. The emphasis was placed on the mechanism of ZnO nanoparticles, and it was clarified that the ZnO nanoparticles acted as an adsorbate and diffusion obstacle that restrained the diffusion of Sn and Cu atoms. Consequently, the growth of the IMC layer was suppressed on account of insufficient activation energy.

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Electromigration reliability for Al2O3-reinforced Cu/Sn–58Bi/Cu composite solder joints

Yang

Zhang

et al. 2016

J Mater Sci: Mater Electron

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Investigation on the Microstructure, Interfacial IMC Layer, and Mechanical Properties of Cu/Sn-0.7Cu-xNi/Cu Solder Joints

Cited by 9 publications

References 27 publications

Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution

Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution

Influence of ZnO nanoparticle addition on interfacial intermetallic compound evolution in Sn-3.0Ag-0.5Cu solder joints

Electromigration reliability for Al2O3-reinforced Cu/Sn–58Bi/Cu composite solder joints

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