Investigation on the Numerical Modeling of Continuous Welding Stress Evolution Behavior in SiP

Xie, Feng; Hu, Shouliang; Li, Yuefang; Chen, Hu; Zhong, Wei

doi:10.1109/icept63120.2024.10668804

2024 25th International Conference on Electronic Packaging Technology (ICEPT) 2024

DOI: 10.1109/icept63120.2024.10668804

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Investigation on the Numerical Modeling of Continuous Welding Stress Evolution Behavior in SiP

Feng Xie,

Shouliang Hu,

Yuefang Li

et al.

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Investigation on the Numerical Modeling of Continuous Welding Stress Evolution Behavior in SiP

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References 7 publications

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