2023 24th International Vacuum Electronics Conference (IVEC) 2023
DOI: 10.1109/ivec56627.2023.10157563
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Investigation on the Short-circuit Withstand Capability of Press-pack IGBT modules with Optimized Package Structures

Renkuan Liu
1
,
Hui Li
2
,
Ran Yao
3
et al.
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