Investigations on laser printing of microcapacitors using poly (methyl methacrylate) dielectric thin films for organic electronics applications

Constantinescu, Cătălin; Rapp, Ludovic; Delaporte, Philippe; Alloncle, Anne-Patricia

doi:10.1016/j.apsusc.2015.10.015

Cited by 11 publications

(4 citation statements)

References 36 publications

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“…Thus, LIFT has been used to bond vertical‐cavity surface‐emitting lasers to silicon grating couplers and single dies to Au contact pads on glass . A hybrid approach combining solid metal films with conductive inks and pastes has also proved feasible in the fabrication of microcapacitors . Furthermore, using fs laser pulses with LIFT operating under the conditions described in Sections and enables the printing of very small metallic features in 2D and 3D configurations for applications such as planar interconnects and vertical vias.…”

Section: Applicationsmentioning

confidence: 99%

Laser‐Induced Forward Transfer: Fundamentals and Applications

Serra

Piqué

2018

Adv Materials Technologies

269

191

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Laser‐induced forward transfer (LIFT) is a digital printing technique that uses a pulsed laser beam as the driving force to project material from a donor thin film toward the receiving substrate whereon that material will be finally deposited as a voxel. This working principle allows LIFT to operate with both solid and liquid donor films, which provides the technique with an unprecedented broad spectrum of printable materials, and thus makes it very competitive over other digital technologies, like inkjet printing. It is not only that LIFT can access a much wider range of ink viscosities and loading particle sizes; the possibility of printing from solid films allows the single‐step printing of multilayers and entire devices, and even makes possible 3D printing. This versatility translates, in turn, into a broad field of applications, from graphics production to printed electronics, from the fabrication of chemical sensors to tissue engineering. This monograph provides an extensive review of the LIFT technique, from its origins to the most recent achievements, focusing on the fundamental aspects of both its working principle and transfer dynamics, as well as on its broad range of applications.

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Section: Applicationsmentioning

confidence: 99%

Laser‐Induced Forward Transfer: Fundamentals and Applications

Serra

Piqué

2018

Adv Materials Technologies

269

191

View full text Add to dashboard Cite

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“…This demonstration highlights the ability of LIFT that can properly deposit specific functional materials on a very confined area for device miniaturization. Moreover, sensitive organics have been printed for fabricating organic electronics such as microcapacitors, organic thin film transistors (OTFT), and organic light‐emitting diodes (OLEDs) . Patterned deposition of polymer light‐emitting diode pixels was realized by the sequential transfer of two different materials (polyfluorene and Al) in individual steps by LIFT .…”

Section: Laser‐assisted Printing Techniquesmentioning

confidence: 99%

Laser Transfer, Printing, and Assembly Techniques for Flexible Electronics

Bian

Zhou

Wan

et al. 2019

Adv Elect Materials

111

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materials and enable innovative applications that are hard to achieve with current microelectronics. Examples vary from biointegrated devices for clinical diagnosis and treatment, [11][12][13] to electronic skin (E-Skin), [14][15][16] energy harvesting/storage devices, [17][18][19][20][21] and sweat sensor, [22,23] to flexible display, [24,25] and to RFID tags, [26,27] etc.Two main kinds of microfabrication processes have been developed for flexible electronics, including the solutionprocessable methods and vacuum-based methods (lithographic patterning and undercut etching). [28] The former is naturally compatible with flexible substrates and can deposit and pattern functional materials in one single step. [29][30][31] They have fabricated various printed electronics with increasing performance, such as conductive metal wires, [32][33][34] thin film transistors (TFTs), [35][36][37] and piezoelectric devices. [38][39][40][41] However, the electronic performance is still limited by the properties of solution-processable functional materials and low resolution of printing techniques, with respect to standard microfabrication process. [42] On the other side, vacuum-based microfabrication techniques provide wellestablished routes to realize high-performance electronics, but generally incompatible with large-area, flexible (polymeric substrates). Ideally, high performance flexible electronics systems are usually fabricated by built-up process that begins with independent fabrication of high-modulus, fragile, chip-scale elements (e.g., IC chips, MEMS, sensors, and power sources) or flexible devices (e.g., flexible sensor, flexible display, and TFT array) on donor wafers, followed by being transferred onto flexible/stretchable substrates.The above manufacturing routes of flexible electronics can be concluded as the transfer of the materials, components, and devices from original fabricated/prepared substrates to flexible ones. The most significant built-in challenge in transferring is to control of interface status to accommodate to the disparate nature of the transferred objects from donor wafer/substrate. Distinctive assembly techniques based on stress-induced interface fracture have been invented to be adaptive to the diversity of material properties and geometric sizes that lead to tremendous differences in mechanical properties. For those conventional rigid electronic components like IC chips, they are transferred by standard single-ejector needle pick-and-place It is challenging to manufacture large-area, ultrathin, flexible/stretchable electronics on an industrial scale. Recent ground-breaking advances in the manufacture of flexible electronics are based on powerful laser processes. Laser irradiation at an internally absorbing interface through a transparent substrate will bring various physical changes and chemical reactions at the interface, accompanied by distinct phenomena. Numerous techniques derived from these phenomena with the unique ability to fabricate materials, structures, and devices on flexible subst...

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“…Laser-induced forward transfer (LIFT) is an additive manufacturing technique that has gained significant attention in recent years due to its ability to digitally fabricate high-quality patterns with precise control over the deposited material. 1 One potential application of LIFT printing is the fabrication of bottom electrodes for organic photovoltaics, which are thin film solar cells incorporating organic materials. The utilization of LIFT printing for the creation of bottom electrodes can be cost effective and offers several advantages such as the incorporation with flexible substrates and the fabrication of high-resolution printed patterns.…”

Section: Introductionmentioning

confidence: 99%

Laser processed Ag nanoparticle conductive grids as bottom electrode for flexible ITO-free organic photovoltaics

Andritsos

Pozov

Theodorakos

et al. 2023

Laser 3D Manufacturing X

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Laser induced forward transfer (LIFT) and laser sintering of metal nanoparticle inks constitute a two-step digital fabrication technique which has been proven a key enabling technology for the fabrication of flexible microelectronic devices. In this work we will present the investigation of the laser printing and sintering process of Ag nanoparticle inks for the production of a conductive grid comprised of parallel lines as replacement for the bottom Indium Tin Oxide (ITO) electrode in organic photovoltaics (OPVs). We study the effect of a range of laser parameters and their impact on the morphological characteristics and the electrical performance of the laser printed conductive grid. The electrical conductivity of the laser printed lines is calculated by means of electrical measurements in a 4-point probe IV station while their morphological characteristics are assessed with profilometry measurements. As a result, flexible ITO-free OPVs incorporating laser-printed Ag grids as a bottom electrode on PET substrates will be presented. The results confirm that the laser printing and sintering combination is an advantageous technique, which can offer a distinguishing solution for applications in highly efficient ITO-free OPVs.

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Investigations on laser printing of microcapacitors using poly (methyl methacrylate) dielectric thin films for organic electronics applications

Cited by 11 publications

References 36 publications

Laser‐Induced Forward Transfer: Fundamentals and Applications

Laser‐Induced Forward Transfer: Fundamentals and Applications

Laser Transfer, Printing, and Assembly Techniques for Flexible Electronics

Laser processed Ag nanoparticle conductive grids as bottom electrode for flexible ITO-free organic photovoltaics

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