Investigations on the mechanism of microweld changes during ultrasonic wire bonding by molecular dynamics simulation

Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging

“…The angle between trace HB of the wire bonder head and the vertical axis through point H was defined as the first reverse angle θ 1 (Figure 7b). The distance between point H and E was defined as Trace height (TH), as shown in (6), (7) and (8). 22 As there are three kinks on the wire loops resulted from the flat-looping type, either kink 2 nd or kink 3 rd can be the highest of the final loop profile.…”

“…Gold wire bonding is the most commonly used technology to interconnect chips with low cost in microelectronics packaging. Since its invention in the 1960s, wire bonding has evolved into a dominant form of first-level chip or circuit interconnect with a large number of fixed user groups and equipment reserves [6][7][8][9][10][11][12][13]. Threedimensional stacked packaging through large-span-ratio and high-density wire bonding can maximize chip integration, boost the device performance, reduce the device size, and shorten the development cycle, which will further ensure a smooth transition of interconnect technology in the Post Moore Era [14].…”

Nonuniform-to-uniform structural transitions induced by ultrasonic vibrations

“…On the atomic scale, molecular dynamics (MD) simulations have exerted attention on the atomic and strain-energy distributions at Al/Al, Cu/Al, Cu/Cu and Ti/Al interfaces joined via an UV-assisted method, 27–35 giving insights into the effect of UVs on the structural evolution of joints. However, there are still no direct images capturing atomic-scale motions of dislocations which, together with atomic diffusion, are involved and essential in material flow and plastic deformation in Mg/Al UVeFSW processes.…”

Plastic Softening Induced by High-Frequency Vibrations Accompanying Uniaxial Tension in Aluminum

“…The MD simulation is a good auxiliary research tool to investigate the evolution of atomic arrangements and dislocation configurations at atomic scale [ 24 , 25 , 26 , 27 , 28 ]. It can overcome the limitations of experimental conditions and exhibit atoms motion trajectories.…”