Colloids and Surfaces A: Physicochemical and Engineering Aspect
 2021
DOI: 10.1016/j.colsurfa.2021.127156
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Investigations on the mechanism of silica particle removal during the Cu buff cleaning process

Pengzhan Liu
1
,
Seok‐Jun Hong
2
,
Sanghuck Jeon
3
et al.
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Cited by 3 publications
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Environmentally friendly buff cleaning of ceria nanoparticles using bubbles in gas-dissolved water

Liu
1
,
Nam
2
,
Jeon
3
et al. 2023
Colloids and Surfaces A: Physicochemical and Engineering Aspect
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Environmentally friendly buff cleaning of ceria nanoparticles using bubbles in gas-dissolved water

Liu
1
,
Nam
2
,
Jeon
3
et al. 2023
Colloids and Surfaces A: Physicochemical and Engineering Aspect
4
0
0
0
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Tangential flow filtration of ceria slurry: Application of a single-pass method to improve buff cleaning

Lee
1
,
Seo
2
,
Kim
3
et al. 2022
Materials Science in Semiconductor Processing
5
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Interaction mechanism of Al2O3 abrasive in tantalum chemical mechanical polishing

Lei,
Jiang,
Zhang
et al. 2024
RSC Adv.
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