Invited Paper: 2023 ICCAD CAD Contest Problem B: 3D Placement with Macros

Hu, Kai-Shun; Chi, Hao-Yu; Lin, I-Jye; Wu, Yi-Hsuan; Chen, Wei-Hsu; Hsieh, Yi-Ting

doi:10.1109/iccad57390.2023.10323747

2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD) 2023

DOI: 10.1109/iccad57390.2023.10323747

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Invited Paper: 2023 ICCAD CAD Contest Problem B: 3D Placement with Macros

Kai-Shun Hu,

Hao-Yu Chi,

I-Jye Lin

et al.

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2024

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Multi-Objective Optimization in 3D Floorplanning

Jiang,

Li,

Yao

2024

Electronics

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Three-dimensional integrated circuits can significantly mitigate the challenges posed by shrinking feature sizes and enable heterogeneous integration. This paper focuses on the 3D floorplanning problem. We formulate it as a multi-objective optimization issue and employ multi-objective simulated annealing to simultaneously optimize area, wirelength and number of vias. During the optimization process, neighboring solutions are explored in the design space through inter-layer or intra-layer perturbations, and decision criteria for the exploration process are formulated based on the dominance relationship of solutions. Test results on the GSRC benchmark demonstrate that our approach delivers superior performance in optimizing area and wirelength. Compared to 2D floorplanning, our method reduces the area by approximately 49% and the wirelength by 21%. Compared to other similar 3D floorplanning methods, we raise the success rate in satisfying the fixed-outline constraint to 100% and improve the wirelength by 3%. The multi-objective simulated annealing method proposed in this paper can effectively address the 3D floorplanning problem.

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Multi-Objective Optimization in 3D Floorplanning

Jiang,

Li,

Yao

2024

Electronics

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Invited Paper: 2023 ICCAD CAD Contest Problem B: 3D Placement with Macros

Cited by 1 publication

References 5 publications

Multi-Objective Optimization in 3D Floorplanning

Multi-Objective Optimization in 3D Floorplanning

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