Invited paper: Sintering mechanism of vapor self-assembled multilayer (VSAM) coated Cu nano particles for application in Cu nano ink

Abstract

Oxidation preventive Cu nano ink was prepared using a vapor self-assembed multi-layer coating method (VSAMs). These particles were prepared using 100 nm Cu nano particles coated with 1-octanethiol under ultrahigh vacuum condition with octanol used as a solvent. Octanol-based non-oxidized 10% (wt.) nano ink was well-dispersed without any surfactant. The conductive ink had good dispersion and remains stable for more than 6 weeks. It also has a low viscosity rating of 8.3 cPs. In addition, 5 µL of copper nano ink was dropped into a 1 cm × 1 cm glass substrate to form a copper pattern. The copper pattern was then sintered at 350°C in a tube furnace in a H 2 gas atmosphere. The resistivity of the film using the fabricated ink was determined to be 5.8 × 10 −6 Ωcm. The results show that the non-oxidized oxidation-preventive copper nano ink is suitable for ink-jet printing.

Preparation of Conductive Nanoink Using Pulsed-Wire-Evaporated Copper Nanoparticles for Inkjet Printing

“…21) Seong et al have shown that 1-octanethiol SAMs on the surface of copper nanoparticles prevented oxidation for about 35 d. 22,23) Previously, preparation of oxidation preventive Cu nano ink was reported where Cu powders were prepared by a polyol process which is a chemical process. 24) In our study, conductive nanoink containing 10 mass% copper, was prepared by dispersing 1-octanethiol-coated copper nanoparticles in organic solvents where Cu powders were prepared by PWE method. This nanoink was then inkjet-printed on glass to form conductive copper patterns.…”