2012
DOI: 10.1063/1.3693992
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Ion assisted growth of B4C diffusion barrier layers in Mo/Si multilayered structures

Abstract: We investigated the thermal stability of e-beam deposited Mo/B4C/Si/B4C layered systems, with and without ion assistance during the growth of the B4C diffusion barrier layers. The thermal stability was investigated by in situ thermal annealing during grazing incidence X-ray reflection. By studying partially treated B4C barrier layers, we found that the improvement in thermal stability is caused by an enhanced density of the B4C layer.

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Cited by 7 publications
(3 citation statements)
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“…Such interlayers also increase thermal stability as was demonstrated in previous studies [31][32][33][34][35]. We note that there are other ways to increase thermal stability.…”
Section: Introductionsupporting
confidence: 83%
“…Such interlayers also increase thermal stability as was demonstrated in previous studies [31][32][33][34][35]. We note that there are other ways to increase thermal stability.…”
Section: Introductionsupporting
confidence: 83%
“…A 10 % increase in B 4 C barrier layer density has been shown to reduce diffusion rates by over one order of magnitude. 16 Diffusion barriers may strongly reduce diffusion rates across interfaces, but can never fully eliminate MoSi 2 formation since the latter process remains energetically favorable as long as pure Mo and Si remain present. Another method to reduce interface formation actually aims at removing the diffusing Mo and Si species by using stable compounds of Mo and Si as base materials for the multilayer.…”
Section: Multilayers With Enhanced Thermal Stabilitymentioning
confidence: 99%
“…10,11 At such thicknesses, the interface imperfections like the interface roughness and the intermixing, become very significant and affect the performance of multilayer devices due to the loss of specular reflectivity. 12,13 Moreover, during the growth of the multilayer, A/B and B/A interfaces are not symmetric due to the inherent difference in the surface free energy (c) of the elements. 14 Hence, improvement of the interface roughness and intermixing is a very important issue in multilayer based devices.…”
Section: Introductionmentioning
confidence: 99%