2007
DOI: 10.1384/jsa.14.124
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Ion Beam Alignment Procedures using a Faraday Cup or a Silicon Dioxide Film on Silicon Substrate with Auger Electron Microscope

Abstract: In surface analysis such as AES (Auger electron spectroscopy) or XPS (x-ray photoelectron spectroscopy), ion sputtering is generally used in order to remove contaminated layers and to perform an in-depth profiling. It is important to align an ion beam at an analysis area and to estimate sputtering rates prior to an actual measurement. In this report, two methods are introduced how to align the ion beam. (a) Faraday cup method is applicable to quantitatively estimate the ion beam by monitoring current and (b) S… Show more

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“…In the regard of the industrial application of SiO 2 , SiO 2 is an important material for the quantitative surface chemical analysis as well as the gate oxide in semiconductor devices. The SiO 2 film has been widely used as reference materials for sputter depth profiling in order to align the ion beam [14], to estimate the etching rate, and to calibrate the sputtered depth. From a practical point of view, the determination of the experimental conditions for the AES measurement of SiO 2 to avoid or reduce the electron-induced damage as much as possible is required.…”
Section: Introductionmentioning
confidence: 99%
“…In the regard of the industrial application of SiO 2 , SiO 2 is an important material for the quantitative surface chemical analysis as well as the gate oxide in semiconductor devices. The SiO 2 film has been widely used as reference materials for sputter depth profiling in order to align the ion beam [14], to estimate the etching rate, and to calibrate the sputtered depth. From a practical point of view, the determination of the experimental conditions for the AES measurement of SiO 2 to avoid or reduce the electron-induced damage as much as possible is required.…”
Section: Introductionmentioning
confidence: 99%
“…SiO 2 is an industrially important material as not only the gate oxide in semiconductor devices but also the reference material for the quantitative surface chemical analysis. A SiO 2 film on the Si substrate has been widely used as reference materials for sputter depth profiling in order to align the ion beam [14], to estimate the etching rate, and to calibrate the sputtered depth. In addition, SiO 2 films can be used as a reference for calibrating the electron-induced damage of samples.…”
Section: Introductionmentioning
confidence: 99%