2016
DOI: 10.1039/c6ce01162d
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Ionic liquid-assisted solvothermal synthesis of three-dimensional hierarchical copper sulfide microflowers at a low temperature with enhanced photocatalytic performance

Abstract: Three-dimension (3D) hierarchical copper sulfide (CuS) microflowers have been successfully constructed by a facile ionic liquid (1-butyl-3-methylimidazolium chloride, [BMIm]Cl) assisted solvothermal method at low temperature (65 o C). The covellite CuS assembled by nanoflakes with the thickness of 8-10 nm and lateral dimension of about 700 nm were obtained by decomposition of intermediate complex Cu3(TAA)3Cl3 (thioacetamide, TAA) blocks. The ionic liquid (IL) could serve as solvent, ligand, and structure-direc… Show more

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Cited by 13 publications
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“…Over the years, large-scale architectures of micro-and nanostructured building components with specic morphology have always been of interest to material scientists and chemists. [1][2][3] In particular, hierarchical and hollow structures have aroused signicant attention because of their distinctive functions, novel properties and extensive applications in drug delivery, 4 photonic crystals, 5 catalysis 6 and other areas. 7,8 In comparison with bulk and nanoparticles, the special hollow self-assemblies should be helpful for constructing functional nano-devices and to go deep into the formation of hollow assemblies.…”
Section: Introductionmentioning
confidence: 99%
“…Over the years, large-scale architectures of micro-and nanostructured building components with specic morphology have always been of interest to material scientists and chemists. [1][2][3] In particular, hierarchical and hollow structures have aroused signicant attention because of their distinctive functions, novel properties and extensive applications in drug delivery, 4 photonic crystals, 5 catalysis 6 and other areas. 7,8 In comparison with bulk and nanoparticles, the special hollow self-assemblies should be helpful for constructing functional nano-devices and to go deep into the formation of hollow assemblies.…”
Section: Introductionmentioning
confidence: 99%