2014
DOI: 10.1016/j.tsf.2013.11.001
|View full text |Cite
|
Sign up to set email alerts
|

Ionized vapor deposition of antimicrobial Ti–Cu films with controlled copper release

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

1
18
0

Year Published

2015
2015
2022
2022

Publication Types

Select...
8
1

Relationship

1
8

Authors

Journals

citations
Cited by 30 publications
(19 citation statements)
references
References 47 publications
1
18
0
Order By: Relevance
“…While some studies were carried up to 24 h [42,46], other studies have been done for various longer periods (ranging from 3 to 20 days) [17,40,45]. …”
Section: Factors Responsible For Antimicrobial Behaviourmentioning
confidence: 99%
“…While some studies were carried up to 24 h [42,46], other studies have been done for various longer periods (ranging from 3 to 20 days) [17,40,45]. …”
Section: Factors Responsible For Antimicrobial Behaviourmentioning
confidence: 99%
“…Formation of Cu-Ti films with controlled level of copper ion release was reported by Strank et al [27]. The copper release has to be controlled in order to repress the bacteria growth and to balance the Cu level tolerated by osteoblast cells.…”
Section: Introductionmentioning
confidence: 93%
“…The ratio of sample surface area and tap water volume was 3:1 (cm 2 /ml). After being incubated in an incubator at 25 C for 24, 48 and 72 h, respectively, the tap water was collected and then the quantity of Cu ions was measured by atomic absorption spectrometry (Z-2000, Hitachi, Japan) [52] . The accuracy of the atomic absorption spectrometry was 0.1 mg/l.…”
Section: Copper Ions Release Measurementmentioning
confidence: 99%