IR-drop modeling and reduction for high-performance printed circuit boards

Zhang, Mu-Shui; Tan, Hongzhou

doi:10.1109/memc.2015.7407188

Cited by 13 publications

(6 citation statements)

References 14 publications

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“…In this demonstration, Port u is not used for the sake of simplicity. The positions of the other ports (x q1 , y q1 ), (x q2 , y q2 ), (x r1 , y r1 ), and (x r2 , y r2 ) are (5,4), (20,22), (20, 10.9), (24,12), and (24 mm, 0.9 mm), respectively. The power integrity characteristics of the PDN segmented by the DGS-EBG structure are analyzed using a self-impedance (Z 11 ).…”

Section: Resultsmentioning

confidence: 99%

“…As show in Figure 1a, the DGS-EBG array configures in various ways to optimize its performance considering power/ground noise isolation, design flexibility, and current-resistance (IR) drop problem. The IR drop problem induces from the narrow branches of the DGS-EBG structure, and the DGS-EBG structure should be cautiously designed considering this limitation [24]. The size of the DGS-EBG array can be defined as the number of DGS-EBG structures and the number of unit cells in a single DGS-EBG structure.…”

Section: Introductionmentioning

confidence: 99%

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Power Integrity Analysis of Power Distribution Network Segmented Using DGS–Electromagnetic Bandgap Structure in Mixed-Signal PCBs

Kim

2020

Electronics

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In this paper, we present the power integrity analysis of a power distribution network (PDN) employing a segmentation technique based on the electromagnetic bandgap (EBG) structure with a defected ground structure (DGS). For efficient analysis of power integrity, a domain decomposition method (DDM) with a novel modeling of the DGS–EBG-based PDN is presented. In the DDM, analytical models for the partitioned parts of the PDN are developed, and their impedance parameters are analytically extracted. The resonant modes for the power integrity analysis are rigorously examined using the DDM and electric-field distribution. The effect of the DGS–EBG stopband on the resonant modes are analyzed. The proposed DDM and power integrity analysis are verified using full-wave simulation and measurements. The DDM result shows good agreement with the full-wave simulation and measurements.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Power Integrity Analysis of Power Distribution Network Segmented Using DGS–Electromagnetic Bandgap Structure in Mixed-Signal PCBs

Kim

2020

Electronics

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“…To establish the matrix equation in the k-th sudomain, the DG test is applied to (1), which leads to the following equation:…”

Section: A Formulation Of Electrostatic Potential Equation By Rtc-dgmentioning

confidence: 99%

“…The reliability problems are becoming more serious with the continuous decreasing DC operation voltage, the increasing integration density, and the ever-shrinking feature sizes. Among them, DC IR-Drop [1] is a major issue in the power integrity (PI) problem, which would bring significant challenges to the design of the power distribution networks (PDN) of integrated circuits (IC) and printed circuit broads (PCB) [2]. In addition, Joule heating resulted thermal effects could be considerable with the shrinking scale of vias and traces, which would have serious impact on the resistivity of the conductors of PDNs.…”

Section: Introductionmentioning

confidence: 99%

DC IR-Drop Analysis of Power Distribution Networks by a Robin Transmission Condition-Enhanced Discontinuous Galerkin Method

Yang

Tang

Mao

et al. 2022

IEEE Trans. Compon., Packag. Manufact. Technol.

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In this work, a novel Robin transmission condition (RTC) enhanced discontinuous Galerkin (DG) method is proposed for the DC IR-Drop analysis of power distribution networks with Joule Heating effects included. Unlike the conventional DG method, the proposed DG method straightforwardly applied to discretize the second-order spatial partial differential governing equations for the electrostatic potential Φ and the steady-state temperature T , respectively. The numerical flux in DG used to facilitate the information exchange among neighboring subdomains introduces two additional variables: the current density J for the electrical potential equation and the thermal flux q for the thermal equation. To solve them, at the interface of neighboring subdomains a RTC is presented as the second equation to establish another connection for solutions in neighboring subdomains. With this strategy, the number of degrees of freedom (DoF) involved in the proposed RTC-DG method is dramatically reduced compared

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“…One of the most critical steps that hamper PCB design development is the generation of a power plane [2], which aims to configure the various metal planes' layout on a PCB. Although there has been significant development in automatic solvers for the critical objectives of PCB design related to power plane generation such as IR-drop solver [3,4,5], power integrity solver [6,7], and signal integrity [8,9,10], the generation of power plane itself still relies on the manual effort of electronics designers. Thus, automatic power plane generation is needed to address an unmet need in PCB design.…”

Section: Introductionmentioning

confidence: 99%

Hierarchical Automatic Power Plane Generation with Genetic Optimization and Multilayer Perceptron

Liao¹,

Patil²,

Dong³

et al. 2022

Preprint

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We present an automatic multilayer power plane generation method to accelerate the design of printed circuit boards (PCB). In PCB design, while automatic solvers have been developed to predict important indicators such as the IR-drop, power integrity, and signal integrity, the generation of the power plane itself still largely relies on laborious manual methods. Our automatic power plane generation approach is based on genetic optimization combined with a multilayer perceptron and is able to automatically generate power planes across a diverse set of problems with varying levels of difficulty. Our method GOMLP consists of an outer loop genetic optimizer (GO) and an inner loop multi-layer perceptron (MLP) that generate power planes automatically. The critical elements of our approach include contour detection, feature expansion, and a distance measure to enable island-minimizing complex power plane generation. We compare our approach to a baseline solution based on A*. The A* method consisting of a sequential island generation and merging process which can produce less than ideal solutions. Our experimental results show that on single layer power plane problems, our method outperforms A* in 71% of the problems with varying levels of board layout difficulty. We further describe H-GOMLP, which extends GOMLP to multilayer power plane problems using hierarchical clustering and net similarities based on the Hausdorff distance.

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IR-drop modeling and reduction for high-performance printed circuit boards

Cited by 13 publications

References 14 publications

Power Integrity Analysis of Power Distribution Network Segmented Using DGS–Electromagnetic Bandgap Structure in Mixed-Signal PCBs

Power Integrity Analysis of Power Distribution Network Segmented Using DGS–Electromagnetic Bandgap Structure in Mixed-Signal PCBs

DC IR-Drop Analysis of Power Distribution Networks by a Robin Transmission Condition-Enhanced Discontinuous Galerkin Method

Hierarchical Automatic Power Plane Generation with Genetic Optimization and Multilayer Perceptron

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